Substrate for image sensor

ABSTRACT

A substrate for an image sensor according to an embodiment includes an insulating layer; and a conductive pattern portion disposed on the insulating layer, wherein the insulating layer comprises: a first insulating part; and a second insulating part surrounding the first insulating part and spaced apart from the first insulating part with an open region therebetween, wherein the conductive pattern portion comprises a first lead pattern part disposed on the first insulating part; a second lead pattern part disposed on the second insulating part; and an extension pattern part disposed on the open region of the insulating layer to connect the first lead pattern part with the second lead pattern part and including a bent portion.

TECHNICAL FIELD

An embodiment relates to a substrate for an image sensor. Specifically,the embodiment relates to a substrate for an image sensor capable ofmoving relative to a lens barrel and a camera module including the same.

BACKGROUND ART

In general, camera devices are mounted in mobile communication terminalsand portable devices such as MP3 players, as well as electronic devicessuch as automobiles, endoscopes, and CCTVs. Such camera devices aregradually being developed centering on high pixels, and miniaturizationand thinning are in progress. In addition, current camera devices arebeing changed so that various additional functions can be implemented atlow manufacturing cost.

The camera device as described above includes a lens barrelaccommodating a lens, a lens holder coupled to the lens barrel, an imagesensor disposed in the lens holder, and a driving substrate on which theimage sensor is mounted. At this time, the lens prod provides an imagesignal of a subject to the image sensor. And the image sensor convertsthe image signal into an electrical signal.

Here, the accuracy of the image signal in the camera device isdetermined according to a focal length defined as the distance betweenthe lens and the image sensor.

Accordingly, the camera device provides focus compensation or shakecompensation by moving the lens barrel relative to the image sensor.That is, the camera device moved the lens barrel accommodating the lensrelative to the image sensor in the X-axis, Y-axis, and Z-axis. At thistime, the camera device required an elastic member such as at least sixsprings to move the lens barrel. In addition, the elastic member wasbonded to the lens barrel by bonding.

However, the camera device according to the prior art as describedabove, by moving the lens barrel, the upper spring plate disposed on thelens barrel, the lower spring plate under the lens barrel, and anelastic wire for fixing the Z-axis (elastic wire) Includes structuressuch as Accordingly, the module structure of the camera device accordingto the prior art has a complicated problem.

In addition, the camera device according to the prior art requires aplurality of elastic members for moving the lens barrel, and there is aproblem in that the number of assembling steps of the plurality ofelastic members increases.

DISCLOSURE Technical Problem

In the embodiment, it is possible to provide a substrate for an imagesensor having a new structure and a camera module including the same.

In addition, in the embodiment, it is possible to provide an imagesensor substrate for an image sensor moving relative to a lens barrel,and a camera module including the same.

In addition, in the embodiment, a substrate for an image sensor capableof not only movement of the X-axis, Y-axis, and Z-axis, but also tiltcorrection, and a camera module including the same are provided.

In addition, in the embodiment, a substrate for an image sensor capableof simplifying a spring structure for providing an auto focus functionor a camera shake compensation function, and a camera module includingthe same can be provided.

The technical problems to be achieved in the proposed embodiment are notlimited to the technical problems mentioned above, and other technicalproblems not mentioned may be clearly understood by those of ordinaryskill in the art to which the proposed embodiment belongs from thefollowing description.

Technical Solution

A substrate for an image sensor according to an embodiment comprises: aspring plate having an elastic member disposed in a first open region;an insulating layer disposed on the spring plate and including a secondopen region exposing the first open region; and a conductive patternportion disposed on the insulating layer, wherein the spring platecomprises a first plate part, and a second plate part disposed tosurround the first plate part with the first open region interposedtherebetween, and connected to the first plate part by the elasticmember, wherein the insulating layer includes a first insulating partdisposed on the first plate part, and a second insulating part disposedon the second plate part, wherein the conductive pattern portion, afirst lead pattern part disposed on the first insulating part, a secondlead pattern part disposed on the second insulating part, and anextension pattern part disposed between the first and second leadpattern parts and floating on the second open region.

In addition, the substrate comprises a first bonding sheet disposedbetween the spring plate and the insulating layer and including a thirdopen region exposing the first open region; and a second bonding sheetdisposed between the insulating layer and the conductive pattern portionand including a fourth open region exposing the second open region.

In addition, a length of the extension pattern part is greater than alinear distance between the first lead pattern part and the second leadpattern part.

In addition, the extension pattern part has a length of 1.5 to 4 timesthe linear distance between the first lead pattern part and the secondlead pattern part.

In addition, the extension pattern part does not overlap with theelastic member in a vertical direction.

In addition, the extension pattern part has a tensile strength of 1000MPa or more.

In addition, the extension pattern part is formed of a binary alloy ofany one of copper (Cu)-nickel (Ni), copper (Cu)-tin (Sn), copper(Cu)-beryllium (Be) and copper (Cu)-cobalt (Co), or a ternary alloy ofany one of copper (Cu)-nickel (Ni)-tin (Sn) and copper (Cu)-beryllium(Be)-cobalt (Co).

In addition, the first lead pattern part, the second lead pattern part,and the extension pattern part include a metal layer disposed on theinsulating layer and the second open region, and a plating layerdisposed on the metal layer, wherein the plating layer of the extensionpattern part is disposed to surround an upper surface, a side surface,and a lower surface of the metal layer of the extension pattern part.

In addition, a distance between a lower surface of the first leadpattern part and on upper surface of the spring plate is equal to adistance between a lower surface of the second lead pattern part and anupper surface of the spring plate, and a distance between the lowersurface of the extension pattern part and the upper surface of thespring plate is smaller than the distance between the lower surface ofthe first lead pattern part and the upper surface of the spring plate orthe distance between the lower surface of the second lead pattern partand the upper surface of the spring plate.

In addition, the spring plate includes a plurality of slits formedpassing through an upper surface and a lower surface of the first platepart.

In addition, a plurality of the first lead pattern parts are disposedaround an image sensor mounting area on an upper surface of the firstinsulating part, and wherein each of the second lead pattern part andthe extension pattern part includes a plurality of parts to berespectively connected to the plurality of first lead pattern parts.

In addition, the substrate includes a supporting layer disposed underthe lower surface of the second plate part.

A camera module according to the embodiment comprises a housing; a lensbarrel disposed in the housing; a lens assembly disposed in the lensbarrel; an image sensor substrate disposed in the housing; an imagesensor disposed on the image sensor substrate; a first driving partdisposed on a lower surface of the image sensor substrate; and a seconddriving part disposed in the housing and having an upper surface facinga lower surface of the first driving part, wherein the image sensorsubstrate comprise: a spring plate having an elastic member disposed ina first open region; an insulating layer disposed on the spring plateand including a second open region exposing the first open region; and aconductive pattern portion disposed on the insulating layer, wherein thespring plate comprises a first plate part, and a second plate partdisposed to surround the first plate part with the first open regioninterposed therebetween, and connected to the first plate part by theelastic member, wherein the insulating layer includes a first insulatingpart disposed on the first plate part, and a second insulating partdisposed on the second plate part, wherein the conductive patternportion, a first lead pattern part disposed on the first insulatingpart, a second lead pattern part disposed on the second insulating part,and an extension pattern part disposed between the first and second leadpattern parts and floating on the second open region.

In addition, the first driving part is disposed under a lower surface ofthe first plate part, and the second driving part interacts with thefirst driving part to move the first driving part so that the imagesensor substrate is moved relative to the lens barrel in a horizontaldirection.

In addition, the camera module comprises a third driving part having anupper surface facing a side surface of the first driving part on a sidesurface of the supporting layer, and the third driving part interactswith the first driving part to move the first driving part so that theimage sensor substrate is moved relative to the lens barrel in avertical direction.

In addition, the extension pattern part has a length of 1.5 to 4 times alinear distance between the first lead pattern part and the second leadpattern part.

In addition, the extension pattern part does not overlap with theelastic member in a vertical direction.

On the other hand, the camera device according to the embodimentincludes a housing; a lens barrel disposed in the housing; a lensassembly disposed in the lens barrel; an image sensor substrate disposedin the housing; an image sensor disposed on the image sensor substrate;and flexible circuit board including a first connector part disposed inthe housing and electrically connected to the image sensor substrate, asecond connector part disposed outside the housing and electricallyconnected to an external device, and a connection part connecting thefirst and second connectors, wherein the image sensor substratecomprise: a spring plate having an elastic member disposed in a firstopen region; an insulating layer disposed on the spring plate andincluding a second open region exposing the first open region; and aconductive pattern portion disposed on the insulating layer, wherein thespring plate comprises a first plate part, and a second plate partdisposed to surround the first plate part with the first open regioninterposed therebetween, and connected to the first plate part by theelastic member, wherein the insulating layer includes a first insulatingpart disposed on the first plate part, and a second insulating partdisposed on the second plate part, wherein the conductive patternportion, a first lead pattern part disposed on the first insulatingpart, a second lead pattern part disposed on the second insulating part,and an extension pattern part disposed between the first and second leadpattern parts and floating on the second open region.

On the other hand, the substrate for an image sensor according toanother embodiment comprises an insulating layer; and a conductivepattern portion disposed on the insulating layer, wherein the insulatinglayer comprises: a first insulating part; a second insulating partsurrounding the first insulating part and spaced apart from the firstinsulating part with a first open region therebetween, and a extensioninsulating part disposed in the first open region and connecting thefirst insulating part and the second insulating part, and the conductivepattern portion comprises: a first lead pattern part disposed on thefirst insulating part; a second lead pattern part disposed on the secondinsulating part; and an extension pattern part on the extensioninsulating part and connecting between the first lead pattern part andthe second lead pattern part.

In addition, the substrate comprises a bonding sheet disposed betweenthe insulating layer and the conductive pattern portion and including asecond open region exposing the first open region, wherein the bondingsheet comprises: a first bonding part between the first lead patternpart and the first insulating part; and a second bonding part betweenthe second lead pattern part and the second insulating part; and anextension bonding part between the extension pattern part and theextension insulating part.

In addition, a length of the extension insulating part is greater than alinear distance of the first open region between the first insulatingpart and the second insulating part.

In addition, the extension insulating part has a length of 1.5 to 4times the linear distance of the first open region between the firstinsulating part and the second insulating part.

In addition, the extension pattern part, the extension insulating part,and the extension bonding part overlap each other in a verticaldirection.

In addition, the length of the extension pattern part is greater than alinear distance between the first lead pattern part and the second leadpattern part.

In addition, the extension pattern part has a length of 1.5 to 4 timesthe linear distance between the first lead pattern part and the secondlead pattern part.

In addition, the extension insulating part has a line width larger thana line width of the extension pattern part.

In addition, the extension pattern part has a tensile strength of 1000MPa or more.

In addition, the extension pattern part is formed of a binary alloy ofany one of copper (Cu)-nickel (Ni), copper (Cu)-tin (Sn), copper(Cu)-beryllium (Be) and copper (Cu)-cobalt (Co), or a ternary alloy ofany one of copper (Cu)-nickel (Ni)-tin (Sn) and copper (Cu)-beryllium(Be)-cobalt (Co).

In addition, the first lead pattern part, the second lead pattern part,and the extension pattern part include a metal layer and a plating layerdisposed on upper and side surfaces of the metal layer.

In addition, a plurality of the first lead pattern parts are disposedaround an image sensor mounting area on an upper surface of the firstinsulating part, and wherein each of the second lead pattern part andthe extension pattern part includes a plurality of parts to berespectively connected to the plurality of first lead pattern parts.

In addition, the substrate comprises a supporting layer disposed underthe lower surface of the second insulating part.

On the other hand, the camera module according to the embodimentcomprises a housing; a lens barrel disposed in the housing; a lensassembly disposed in the lens barrel; an image sensor substrate disposedin the housing; an image sensor disposed on the image sensor substrate;a first driving part disposed on a lower surface of the image sensorsubstrate; and a second driving part disposed in the housing and havingan upper surface facing a lower surface of the first driving part,wherein the image sensor substrate comprise: an insulating layer; and aconductive pattern portion disposed on the insulating layer, wherein theinsulating layer comprises: a first insulating part; a second insulatingpart surrounding the first insulating part and spaced apart from thefirst insulating part with a first open region therebetween, and anextension insulating part disposed in the first open region andconnecting the first insulating part and the second insulating part, andthe conductive pattern portion comprises: a first lead pattern partdisposed on the first insulating part; a second lead pattern partdisposed on the second insulating part; and an extension pattern part onthe extension insulating part and connecting between the first leadpattern part and the second lead pattern part.

In addition, the first driving part is disposed under a lower surface ofthe first plate part, and the second driving part interacts with thefirst driving part to move the first driving part so that the imagesensor substrate is moved relative to the lens barrel in a horizontaldirection.

In addition, the camera module comprises a third driving part having anupper surface facing a side surface of the first driving part on a sidesurface of the supporting layer, and the third driving part interactswith the first driving part to move the first driving part so that theimage sensor substrate is moved relative to the lens barrel in avertical direction.

In addition, the extension pattern part has a length of 1.5 to 4 times alinear distance between the first lead pattern part and the second leadpattern part.

On the other hand, the camera device according to the embodimentincludes a housing; a lens barrel disposed in the housing; a lensassembly disposed in the lens barrel; an image sensor substrate disposedin the housing; an image sensor disposed on the image sensor substrate;and flexible circuit board including a first connector part disposed inthe housing and electrically connected to the image sensor substrate, asecond connector part disposed outside the housing and electricallyconnected to an external device, and a connection part connecting thefirst and second connectors, wherein the image sensor substratecomprise: an insulating layer; and a conductive pattern portion disposedon the insulating layer, wherein the insulating layer comprises: a firstinsulating part; a second insulating part surrounding the firstinsulating part and spaced apart from the first insulating part with afirst open region therebetween, and an extension insulating partdisposed in the first open region and connecting the first insulatingpart and the second insulating part, and the conductive pattern portioncomprises: a first lead pattern part disposed on the first insulatingpart; a second lead pattern part disposed on the second insulating part;and an extension pattern part on the extension insulating part andconnecting between the first lead pattern part and the second leadpattern part, wherein the first connector part includes a pad partdisposed on the second insulating part and connected to the second leadpattern part, wherein the extension pattern part has a length of 1.5 to4 times the linear distance between the first lead pattern part and thesecond lead pattern part, and wherein the extension insulating part hasa line width larger than a line width of the extension pattern part.

Effects of the Invention

According to an embodiment, in order to implement the OIS and AFfunctions of the camera module, instead of moving the conventional lensbarrel, the image sensor is moved relative to the lens barrel in theX-axis, Y-axis and Z-axis directions. Accordingly, the camera moduleaccording to the embodiment may remove a complex spring structure forimplementing the OIS and AF functions, and thus the structure may besimplified. In addition, by moving the image sensor according to theembodiment relative to the lens barrel, it is possible to provide astable structure compared to the conventional structure.

In addition, according to an embodiment, the extension pattern partelectrically connected to the image sensor has a spring structure and isdisposed in a floating form on the spring plate.

In addition, in the insulating layer, an extension insulating parthaving a spring shape is disposed in a region vertically overlappingwith the extension pattern part. Accordingly, the camera module mayelastically support the image sensor more stably and move the imagesensor with respect to the lens barrel.

In addition, the length of the extension pattern part in the embodimentis set to be at least 1.5 to 4 times the linear distance between thefirst lead pattern part and the second lead pattern part. Accordingly,noise generation can be minimized while improving the mobility of theimage sensor substrate.

In addition, in the embodiment, the width of the extension insulatingpart is made larger than the width of the extension pattern part, sothat the extension pattern part can be stably supported by the extensioninsulating part, thereby improving operational reliability.

In addition, according to the embodiment, the elastic member and theextension pattern part are not aligned with each other in a verticaldirection, thereby solving an electrical reliability problem that mayoccur due to contact between the elastic member and the extensionpattern part.

DESCRIPTION OF DRAWINGS

FIG. 1 is a view showing a camera module according to a comparativeexample.

FIG. 2 is a view showing a camera device according to a firstembodiment.

FIG. 3 is a view showing a spring plate shown in FIG. 2.

FIG. 4 is a view showing first and second bonding sheets shown in FIG.2.

FIG. 5 is a view showing a first embodiment of the insulating layershown in FIG. 2.

FIG. 6 is a view showing a second embodiment of the insulating layershown in FIG. 2.

FIG. 7 is a view showing a third embodiment of the insulating layershown in FIG. 2.

FIG. 8 is a view showing a pattern part shown in FIG. 2.

FIG. 9 is a plan view of a substrate for an image sensor according tothe first embodiment.

FIG. 10 is a view showing a connection structure between a flexiblecircuit board and an image sensor substrate according to the firstembodiment.

FIG. 11 is a view specifically showing a layer structure of a conductivepattern portion according to the first embodiment.

FIG. 12 is a view showing a modified example of the camera module.

FIG. 13 is a view showing a X-axis displacement simulation of a springplate according to the first embodiment.

FIG. 14 is a view showing a Y-axis displacement simulation of a springplate according to the first embodiment.

FIG. 15 is a view showing a Z-axis displacement simulation of a springplate according to the first embodiment.

FIG. 16 is a view showing a tilt axis displacement simulation of aspring plate according to the first embodiment.

FIG. 17 is a view showing a camera device according to a secondembodiment.

FIG. 18 is a view showing an example of the insulating layer shown inFIG. 17.

FIG. 19 is a view showing a modified example of the insulating layershown in FIG. 17.

FIG. 20 is a view showing a second bonding sheet shown in FIG. 17.

FIG. 21 is a view showing a conductive pattern portion shown in FIG. 17.

FIG. 22 is a plan view of a substrate for an image sensor according to asecond embodiment.

FIG. 23 is a view showing a connection structure between a flexiblecircuit board and an image sensor substrate according to a secondembodiment.

FIG. 24 is a view specifically showing a layer structure of a conductivepattern portion according to a second embodiment.

FIG. 25 is a view showing a camera device according to a thirdembodiment.

FIG. 26A and FIG. 26B are views showing a camera device according to afourth embodiment.

BEST MODE

Hereinafter, embodiments of the present invention will be described indetail with reference to the accompanying drawings.

However, the spirit and scope of the present invention is not limited toa part of the embodiments described, and may be implemented in variousother forms, and within the spirit and scope of the present invention,one or more of the elements of the embodiments may be selectivelycombined and replaced.

In addition, unless expressly otherwise defined and described, the termsused in the embodiments of the present invention (including technicaland scientific terms may be construed the same meaning as commonlyunderstood by one of ordinary skill in the art to which this inventionbelongs, and the terms such as those defined in commonly useddictionaries may be interpreted as having a meaning that is consistentwith their meaning in the context of the relevant art. Further, theterms used in the embodiments of the present invention are fordescribing the embodiments and are not intended to limit the presentinvention.

In this specification, the singular forms may also include the pluralforms unless specifically stated in the phrase, and may include at leastone of all combinations that may be combined in A, B, and C whendescribed in “at least one (or more) of A (and), B, and C”. Further, indescribing the elements of the embodiments of the present invention, theterms such as first, second, A, B, (A, and (b) may be used.

These terms are only used to distinguish the elements from otherelements, and the terms are not limited to the essence, order, or orderof the elements. In addition, when an element is described as being“connected”, “coupled”, or “connected” to another element, it mayinclude not only when the element is directly “connected” to, “coupled”to, or “connected” to other elements, but also when the element is“connected”, “coupled”, or “connected” by another element between theelement and other elements.

In addition, when described as being formed or disposed “on (over)” or“under (below)” of each element, the “on (over)” or “under (below)” mayinclude not only when two elements are directly connected to each other,but also when one or more other elements are formed or disposed betweentwo elements. Further, when expressed as “on (over)” or “under (below)”,it may include not only the upper direction but also the lower directionbased on one element.

Hereinafter, embodiments of the present disclosure will be described indetail with reference to the accompanying drawings.

FIG. 1 is a view showing a camera module according to a comparativeexample.

A camera module having an optical image stabilizer (OIS) function and anAuto Focusing (AF) function requires at least two spring plates.

The camera module according to the comparative example may have twospring plates. The camera module according to the comparative examplerequires an elastic member such as at least six springs for the springplate.

Referring to FIG. 1, the camera module according to the comparativeexample includes an optical system including a lens assembly, aninfrared cut-off filter, and a sensor unit. That is, the camera moduleaccording to the comparative example includes a lens barrel 10, a lensassembly 20, a first elastic member 31, a second elastic member 32, afirst housing 41, a housing 42, an infrared cut-off filter 50, a sensorunit 60, a circuit board 80, and driving parts 71, 72, 73, and 74.

In this case, the lens barrel 10 is connected to the first housing 41.That is, the lens barrel 10 is connected to the first housing 41 via thefirst elastic member 31. That is, the lens barrel 10 is connected to thefirst housing 41 so as to be movable by the first elastic member 31. Inthis case, the first elastic member 31 includes a plurality of springs(not shown). For example, the first elastic member 31 connects betweenthe lens barrel 10 and the first housing 41 at a plurality of points ofthe lens barrel 10.

The second elastic member 32 is connected to the first housing 41 andthe second housing 42 accommodating the first housing 41. The secondelastic member 32 fixes the first housing 41 to the second housing 42 soas to be movable. The second elastic member 32 includes a plurality ofsprings. In detail, the second elastic member 32 includes a plate-shapedspring.

In this case, the first elastic member 31 moves the lens barrel 10relative to the sensor unit 60 in a vertical direction (a Z-axisdirection) while supporting the lens barrel 10. To this end, the firstelastic member 31 includes at least four springs.

In addition, the second elastic member 32 moves the lens barrel 10relative to the sensor unit 60 in a horizontal direction (an X-axisdirection and a Y-axis direction) while supporting the lens barrel 10.To this end, the second elastic member 32 includes at least two springs.

As described above, in the camera module according to the comparativeexample, OIS and AF are performed as the lens barrel 10 moves in theX-axis, Y-axis, and Z-axis directions. To this end, the camera moduleaccording to the comparative example requires at least six elasticmembers such as springs. In addition, the camera module according to thecomparative example requires two spring plates for supporting theelastic member as described above. Further, the camera module accordingto the comparative example requires an additional member such as anelastic wire for fixing the Z-axis of the lens barrel 10. Therefore, thecamera module according to the comparative example has a complicatedspring structure for moving the lens barrel in the X-axis, Y-axis andZ-axis directions.

In addition, in the camera module according to the comparative example,it is necessary to manually perform an operation of bonding therespective elastic members in order to couple the elastic member withthe lens barrel 10. Accordingly, the camera module according to thecomparative example has a complicated manufacturing process and requiresa long manufacturing time.

In addition, the camera module according to the comparative exampleprovides a tilt function of the lens barrel 10, but has a structure inwhich tilt correction of an image is substantially difficult. That is,even though the lens barrel 10 rotates with respect to the sensor unit60, an image incident on the sensor unit 60 does not change, and thusthe tilt correction of the image is difficult, and further, the tiltfunction itself is unnecessary.

Hereinafter, a substrate for an image sensor, a camera module, and acamera device including the same according to an embodiment will bedescribed.

FIG. 2 is a view showing a camera device according to the firstembodiment.

Referring to FIG. 2, the camera device according to the first embodimentincludes a lens barrel 100, a lens assembly 200, a housing 300, aninfrared cut filter part 400, a driving part 510, 520, 530, and an imagesensor substrate 600, an image sensor 700, and a flexible circuit board800.

The lens barrel 100 accommodates the lens assembly 200.

The lens barrel 100 may include a receiving groove for accommodating thelens assembly 200. The receiving groove may have a shape correspondingto the lens assembly 200.

The lens barrel 100 may have a rectangular tube shape or a cylindricalshape. That is, the outer periphery of the lens barrel 100 may have arectangular tube shape or a cylindrical shape, but the embodiment is notlimited thereto.

The lens barrel 100 is connected to the housing 300. The lens barrel 100is accommodated in the housing 300. The lens barrel 100 may be coupledto the housing 300 by a separate coupling member (not shown).

The lens barrel 100 may include an open region in an upper portionthereof. Preferably, the lens barrel 100 may include a light entrancegroove that is open to an object side. The light entrance groove mayexpose the lens assembly 200. In addition, an image may be incident onthe lens assembly 200 via the light entrance groove.

The lens assembly 200 is disposed in the lens barrel 100. The lensassembly 200 is accommodated in the accommodating groove provided in thelens barrel 100. The lens assembly 200 may be inserted into and fixed tothe accommodating groove of the lens barrel 100. The lens assembly 200may have a circular outer shape. For example, the lens assembly 200 mayhave a circular shape when viewed from a top side, but the embodiment isnot limited thereto. That is, the lens assembly 200 may have arectangular shape when viewed from the top side.

The lens assembly 200 includes a plurality of lenses. For example, thelens assembly 200 may include first to fourth lenses. The first tofourth lenses may be sequentially stacked. In addition, a spacer (notshown) may be interposed between the lenses. The spacer may space adistance between the lenses constant. In the above, the lens assembly200 has been described as including four lenses, but the embodiment isnot limited thereto. For example, the lens assembly 200 may include oneto three lenses, or may include five or more lenses.

The housing 300 accommodates the lens barrel 100. The housing 300 fixesa position of the lens barrel 100 via a separate fixing member (notshown). That is, according to the comparative example, the lens barrelis coupled to be movable with respect to the housing. Unlike this, in anembodiment, the housing 300 may be firmly fixed via the fixing membersuch that the lens barrel 100 does not move in the housing 300.Accordingly, the position of the lens barrel 100 in the housing 300 isalways fixed. Accordingly, in the embodiment, since the lens barrel 100is always fixed at the same position, it is possible to solve a problemof distortion of an optical axis caused by warping of the lens barrel,etc., thereby improving reliability

The housing 300 may be formed of plastic or metal. The housing 300 mayhave a rectangular tube shape.

The infrared cut-off filter part 400 may be disposed at a lower end ofthe lens barrel 100. The infrared cut-off filter part 400 may be fixedlydisposed on a separate substrate (not shown), and accordingly, it may becoupled to the lens barrel 100. The infrared cut-off filter part 400 mayblock light having an excessive long wavelength flowing into the imagesensor 700.

The infrared cut-off filter 400 may be formed by alternately depositingtitanium oxide and silicon oxide on an optical glass. In this case,thicknesses of the titanium oxide and the silicon oxide constituting theinfrared cut-off filter 400 may be appropriately adjusted in order toblock infrared rays.

The driving parts 510, 520, and 530 move the image sensor substrate 600relative to the fixed lens barrel 100. The driving parts 510, 520, and530 move the image sensor substrate 600 relative to the fixed housing300. The driving part 510, 520, and 530 move the image sensor substrate600 relative to the fixed lens assembly 200.

To this end, the driving parts 510, 520, and 530 may move the imagesensor substrate 600 relative to magnetic force. The driving parts 510,520, and 530 may include a first driving part 510, a second driving part520, and a third driving part 530.

The first driving part 510 is attached to the image sensor substrate600. Preferably, the first driving part 510 may be attached to a lowersurface of the image sensor substrate 600. More preferably, the firstdriving part 510 may be attached to a lower surface of the insulatinglayer 610 constituting the image sensor substrate 600. The first drivingpart 510 may include a magnet. For example, the first driving part 510may include a permanent magnet. In this case, the magnet constitutingthe first driving part 510 may have a plate shape. Accordingly, thefirst driving part 510 may include an upper surface, a lower surface,and side surfaces.

The second driving part 520 may be disposed on a bottom surface of thehousing 300. Preferably, the second driving part 520 may be disposed onthe bottom surface of the housing 300 overlapped with the image sensorsubstrate 600 in a vertical direction. The second driving part 520 mayinclude a coil. The second driving part 520 may receive a driving signaland generate a magnetic field according to the driving signal.

In this case, the first driving part 510 and the second driving part 520may face each other. That is, the first driving part 510 and the seconddriving part 520 may be disposed to be overlapped with each other in thevertical direction. The first driving part 510 and the second drivingpart 520 may be disposed side by side in the horizontal direction. Thatis, the lower surface of the first driving part 510 and an upper surfaceof the second driving part 520 may be disposed to face each other. Aseparation distance between the first driving part 510 and the seconddriving part 520 may be 50 μm to about 1000 μm, but the embodiment isnot limited thereto.

Magnetic force may be generated between the first driving part 510 andthe second driving part 520. Accordingly, the image sensor substrate 600may move in the X-axis direction and the Y-axis direction by repulsionforce or attraction force generated between the second driving part 520and the first driving part 510. In addition, the image sensor substrate600 may be tilted (or rotated) according to a change in a direction of acurrent applied to the second driving part 520. To this end, the seconddriving part 520 and the first driving part 510 may each include aplurality of magnets and a plurality of coils.

The third driving part 530 may be attached to the image sensor substrate600. Preferably, the third driving part 530 may be attached to a sidewall of the image sensor substrate 600. In detail, the third drivingpart 530 may be attached to a side surface of the supporting layer 660of the image sensor substrate 600. In this case, at least a portion ofthe third driving part 530 may be disposed to be overlapped with thefirst driving part 510 in the horizontal direction. The third drivingpart 530 may be disposed perpendicular to the first driving part 510.That is, an upper surface of the third driving part 530 may be disposedto face the side surface of the first driving part 510. Accordingly, theimage sensor substrate 600 may move in the Z-axis direction byattraction force and repulsion force between the third driving part 530and the first driving part 510.

The image sensor substrate 600 is a substrate on which the image sensor700 is mounted. In detail, the image sensor substrate 600 may be drivenby the driving parts 510, 520, and 530 to move the image sensor 700 inthe X, Y, and Z-axis directions. In addition, the image sensor substrate600 may be driven by the driving parts 510, 520, and 530 to tilt theimage sensor 700.

The image sensor substrate 600 may be disposed to be spaced apart fromthe bottom surface of the housing 300 by a predetermined distance. Inaddition, the image sensor substrate 600 may move the mounted imagesensor 700 relative to the housing 300.

To this end, the image sensor substrate 600 may include a spring plate610, a first bonding sheet 620, an insulating layer 630, a secondbonding sheet 640, a conductive pattern portion 650, and a supportinglayer 660.

The spring plate 610 supports the insulating layer 630 and theconductive pattern portion 650 constituting the image sensor substrate600. In addition, the spring plate 610 may move the image sensor 700disposed on the image sensor substrate 600 in the X-axis, Y-axis andZ-axis directions. To this end, the spring plate 610 may include atleast one elastic member. Preferably, the spring plate 610 may include aplurality of elastic members. For example, the spring plate 610 mayinclude four elastic members.

The spring plate 610 may be formed of a metal material such as stainlesssteel (STS) or invar, but is not limited thereto. For example, thespring plate 610 may be formed of another metal material such as aspring material having elasticity in addition to the above material.That is, the spring plate 610 may have a certain elastic force.Accordingly, the spring plate 610 may elastically support the imagesensor substrate 600 and move the image sensor substrate 600 in theX-axis, Y-axis and Z-axis directions.

An insulating layer 630 is disposed on the spring plate 610. In thiscase, a first bonding sheet 620 may be disposed between the spring plate610 and the insulating layer 630. The first bonding sheet 620 may bedisposed between the spring plate 610 and the insulating layer 630 toprovide adhesion. That is, the first bonding sheet 620 may fix theinsulating layer 630 on the spring plate 610. To this end, the firstbonding sheet 620 may be formed of a double-sided adhesive film. Thefirst bonding sheet 620 may be formed of an epoxy or acrylic adhesive.

An insulating layer 630 is disposed on the first bonding sheet 620. Thatis, the insulating layer 630 may be attached on the spring plate 610 bythe first bonding sheet 620.

The insulating layer 630 is a substrate for forming the conductivepattern portion 650. The insulating layer 630 may include all of aprinted circuit board, a wiring board, and an insulating substrate madeof an insulating material capable of forming the conductive patternportion 650 on the surface.

The insulating layers 610 may be rigid or flexible. For example, theinsulating layer 610 may include glass or plastic. Specifically, theinsulating layer 610 may include a chemically tempered/semi-temperedglass, such as soda lime glass, aluminosilicate glass, etc., a temperedor flexible plastic such as polyimide (PI), polyethylene terephthalate(PET), propylene glycol (PPG), polycarbonate (PC), etc., or sapphire.

Further, the insulating layer 610 may include an optically isotropicfilm. For example, the insulating layer 610 may include cyclic olefincopolymer (COC), cyclic olefin polymer (COP), optically isotropic PC,optically isotropic polymethylmethacrylate (PMMA), etc.

In this case, the insulating layer 610 may be partially bent whilehaving a curved surface. That is, the insulating layer 610 may partiallyhave a plane and may partially be bent while having a curved surface. Inaddition, the insulating layer 610 may be a flexible substrate havingflexibility. Further, the insulating layer 610 may be a curved or bendedsubstrate.

A conductive pattern portion 650 is disposed on the insulating layer630. The conductive pattern portion 650 may include a lead pattern partspaced apart from each other by a predetermined distance on theinsulating layer 630. For example, the conductive pattern portion 650may include a first lead pattern part connected to the image sensor 700and a second lead pattern part connected to the flexible circuit board800. In addition, the conductive pattern portion 650 may include anextension pattern part connecting the first lead pattern part and thesecond lead pattern part. The first lead pattern part, the second leadpattern part, and the extension pattern part will be described in detailbelow.

The conductive pattern part 650 is a wiring for transmitting anelectrical signal, and may be formed of a metal material having highelectrical conductivity. For this, the conductive pattern part 640 maybe formed of at least one metal material selected from among gold (Au),silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), andzinc (Zn). In addition, the circuit pattern 112 may be formed of pasteor solder paste including at least one metal material selected fromamong gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn),copper (Cu), and zinc (Zn), which are excellent in bonding strength.

Preferably, the conductive pattern part 650 serves as a wiring fortransmitting an electrical signal, and may be formed of a metallicmaterial having an elastic force movable in the X-axis, Y-axis, andZ-axis directions by interlocking with the elastic member of the siringplate 610. To this end, the conductive pattern part 650 may be formed ofa metal material having a tensile strength of 1000 MPa or more. Forexample, the conductive pattern part 650 may be a binary alloy orternary alloy containing copper. For example, the conductive patternportion 650 may be a binary alloy of copper (Cu)-nickel (Ni). Forexample, the conductive pattern portion 650 may be a binary alloy ofcopper (Cu)-tin (Sn). For example, the conductive pattern part 640 maybe a binary alloy of copper (Cu)-beryllium (Be). For example, theconductive pattern part 640 may be a binary alloy of copper (Cu)-cobalt(Co). For example, the conductive pattern portion 650 may be a ternaryalloy of copper (Cu)-nickel (Ni)-tin (Sn). For example, the conductivepattern portion 650 may be a ternary alloy of copper (Cu)-beryllium(Be)-cobalt (Co). In addition, in addition to the metal material, theconductive pattern portion 650 may be formed of an alloy of iron (Fe),nickel (Ni), zinc (Zn), and the like having an elastic force capable ofacting as a spring and having good electrical characteristics. Further,the conductive pattern portion 650 may be surface-treated with a platinglayer containing a metal material such as gold (Au), silver (Ag),palladium (Pd), and the like, thereby improving electrical conductivity.

Meanwhile, the conductive pattern portion 650 may be formed by a generalprocess of manufacturing a printed circuit board, such as an additiveprocess, a subtractive process, a modified semi additive process (MSAP),a semi additive process (SAP), etc., and detailed descriptions thereofwill be omitted herein.

The supporting layer 660 may be a supporting substrate. A third drivingpart 530 may be mounted on the supporting layer 660. Accordingly, anelectric signal may be applied to the third driving part 530. Thesupporting layer 660 may support the spring plate 610. Preferably, thesupporting layer 660 may support the spring plate 610, the first bondingsheet 620, the second bonding sheet 640, the insulating layer 630, theconductive pattern portion 650 and the image sensor 700 at a positionfloating from a bottom surface of the housing 300.

The image sensor 700 is disposed on the image sensor substrate 600.Preferably, the image sensor 700 is disposed on the conductive patternportion 650 of the image sensor substrate 600. The image sensor 700 maybe mounted on the first lead pattern part constituting the conductivepattern portion 650 of the image sensor substrate 600.

The image sensor 700 may be composed of a charge coupled device (CCD) ora complementary metal oxide semiconductor (CMOS) sensor, and may be adevice that outputs a photographed object using a photoelectricconversion element and a charge coupled element as an electrical signal.The image sensor 700 may be electrically connected to the conductivepattern portion 650 on the image sensor substrate 600, and receive animage provided from the lens assembly 200. In addition, the image sensor700 may convert the received image into an electrical signal and outputthe electrical signal. In this case, a signal output through the imagesensor 700 may be transmitted to the flexible circuit board 800 via theconductive pattern portion 650.

One end of the flexible circuit board 800 may be connected to the imagesensor substrate 600. The flexible circuit board 800 may receive anelectrical signal output from the image sensor 700. The flexible circuitboard 800 may have a connector at the other end. A main board (notshown) may be connected to the connector.

That is, the flexible circuit board 800 may connect the camera moduleand the main board of the external device. Specifically, the flexiblecircuit board 800 may connect between the conductive pattern portion 650of the image sensor substrate 600 of the camera module and the mainsubstrate of the portable terminal.

To this end, a region of the flexible circuit board 800 is disposedinside the housing 300, and accordingly, may be connected to theconductive pattern portion 650 of the image sensor substrate 600.

Hereinafter, the image sensor substrate 600 according to the firstembodiment will be described in more detail.

FIG. 3 is a view showing the spring plate shown in FIG. 2.

Referring to FIG. 3, the spring plate 610 may elastically support theinsulating layer 630 and the conductive pattern portion 650 constitutingthe image sensor substrate 600.

The spring plate 610 may move the image sensor 700 disposed on the imagesensor substrate 600 in the X-axis, Y-axis and Z-axis directions.

To this end, the spring plate 610 may be formed of a material havingelasticity.

Specifically, the spring plate 610 may include a plurality of elasticmembers having elastic force. For example, the spring plate 610 mayinclude four elastic members 614, 615, 616, and 617.

The spring plate 610 may be formed of a metal material such as stainlesssteel (STS) or invar, but the embodiment is not limited thereto. Forexample, the spring plate 610 may be formed of another metal material ofa spring material having elastic force in addition to the material. Thatis, the spring plate 660 may have a predetermined elastic force, andaccordingly, the spring plate 610 may move the image sensor substrate600 in the X-axis, Y-axis, and Z-axis directions while elasticallysupporting the image sensor substrate 600.

The spring plate 610 may include a first plate part 611, a second platepart 612, and elastic members 614, 615, 616, and 617.

Specifically, the spring plate 610 may have a first plate part 611disposed at the center thereof. In addition, the second plate part 612may be disposed surrounding the first plate part 611 at a positionspaced apart from the first plate part 611 by a predetermined distance.

That is, the spring plate 610 may include the first plate part 611 andthe second plate part 612. And, an open region 613 is formed between thefirst plate part 611 and the second plate part 612. Preferably, thefirst plate part 611 and the second plate part 612 may be separated fromeach other.

The elastic members 614, 615, 616, and 617 may have one end connected tothe first plate part 611 and the other end connected to the second platepart 612. To this end, the elastic members 614, 615, 616, 617 mayinclude a first elastic member 614, a second elastic member 615, a thirdelastic member 616, and a fourth elastic member 617.

The first elastic member 614 may connect a first corner region of thefirst plate part 611 and a first corner region of the second plate part612. The first elastic member 614 has one end connected to the firstcorner region of the first plate part 611 and the other end connected tothe first corner region of the second plate part 612. And, the firstelastic member 614 may elastically connect them. The first corner regionmay be a corner portion located at an upper left of each plate.

The second elastic member 615 may connect a second corner region of thefirst plate part 611 and a second corner region of the second plate part612. The second elastic member 615 has one end connected to the secondcorner region of the first plate part 611 and the other end connected tothe second corner region of the second plate part 612. And, the secondelastic member 615 may elastically connect them. The second cornerregion may be a corner portion located at an upper right of each plate.

The third elastic member 616 may connect a third corner region of thefirst plate part 611 and a third corner region of the second plate part612. The third elastic member 616 has one end connected to the thirdcorner region of the first plate part 611 and the other end connected tothe third corner region of the second plate part 612. And, the thirdelastic member 616 may elastically connect them. The third corner regionmay be a corner portion located at the lower left of each plate.

The fourth elastic member 617 may connect a fourth corner region of thefirst plate part 611 and a fourth corner region of the second plate part612. The fourth elastic member 617 has one end connected to the fourthcorner region of the first plate part 611 and the other end connected tothe fourth corner region of the second plate part 612. And, the fourthelastic member 617 may elastically connect them. The fourth cornerregion may be a corner portion located at the lower right of each plate.

Meanwhile, in the drawings, each of the first plate part 611, the secondplate part 612, and the elastic members 614, 615, 616, and 617 isillustrated as being configured separately, but is not limited thereto.That is, the first plate part 611, the second plate part 612, and theelastic members 614, 615, 616, and 617 may be integrally formed witheach other. That is, the spring plate 610 may form an open region 613 onthe plate of the plate-like member in the remaining portions except forportions corresponding to the elastic members 614, 615, 616, and 617.

Such the spring plate 610 may have a thickness of 10 μm to 100 μm. Forexample, the spring plate 610 may have a thickness of 20 μm to 70 μm.For example, the spring plate 610 may have a thickness of 40 μm to 50μm. When the thickness of the spring plate 660 exceeds 100 μm, athickness of the image sensor substrate 600 may increase. In addition,when the thickness of the spring plate 610 is smaller than 10 μm, astress generated during movement of the image sensor substrate 600 maynot be sufficiently maintained. Preferably, the spring plate 610 is setto have a thickness of 50 μm±10 μm to maintain a stress of 600 MPa ormore.

In addition, the elastic members 614, 615, 616, and 617 have a lengthequal to or greater than a predetermined level. When the length of theelastic members 614, 615, 616, and 617 is too long, there is a problemthat a volume of the spring plate 610 becomes large, and when the lengthof the elastic members 614, 615, 616, and 617 is too short, it may notbe possible to stably and elastically support the image sensor substrate600. Therefore, the elastic members 614, 615, 616, and 617 have a lengthof 50 μm to 100 μm. At this time, the length of the elastic members 614,615, 616, and 617 is larger than the width of the open region 613. Thatis, the elastic members 614, 615, 616, and 617 may be formed to have ashape of a plurality of bent springs in the open region 613.

In addition, a plurality of slits 618 are formed in the first plate part611. The plurality of slits 618 may be spaced apart from each other by apredetermined distance on the first plate part 61. The plurality ofslits 618 may be formed for reducing a weight of the spring plate 610.In addition, the plurality of slits 618 may be formed for flatness ofthe spring plate 610. That is, the insulating layer 630, the conductivepattern portion 650, and the image sensor 700 are disposed on the firstplate part 611. The first driving part is disposed below the first platepart 611. In this case, flatness of the first driving part or the imagesensor 700 directly affects the reliability of the camera module, andthe image quality may be deteriorated as the flatness is worsen.Therefore, in the embodiment, not only the weight of the spring plate610 may be reduced but also the flatness may be maintained by formingthe plurality of slits 618 in the first plate part 611, therebyimproving overall reliability of the camera module.

FIG. 4 is a view showing first and second bonding sheets shown in FIG.2.

Referring to FIG. 4, a first bonding sheet 620 is disposed on the springplate 610. In this case, the first bonding sheet 620 has a planar shapecorresponding to the planar shape of the spring plate 610.

That is, the first bonding sheet 620 includes a first bonding part 621disposed on the first plate part 611 of the spring plate 610 and asecond bonding part 622 disposed on the second plate part 612 of thespring plate 610. In addition, the first bonding sheet 620 may includean open region 623 between the first bonding part 621 and the secondbonding part 622.

The second bonding part 622 is disposed surrounding the first bondingpart 621 at a position spaced apart from the first bonding part 621 by apredetermined distance. In this case, the second bonding part 622 doesnot directly contact the first bonding part 621. Accordingly, the firstbonding part 621 and the second bonding part 622 may be separated fromeach other through the open region 623.

Meanwhile, the open region 623 of the first bonding sheet 620 mayoverlap the open region 613 of the spring plate 610 in a verticaldirection. Preferably, a planar area of the open region 623 of the firstbonding sheet 620 may be the same as a planar area of the open region613 of the spring plate 610. In addition, the first bonding sheet 620does not overlap with the elastic members 614, 615, 616, 617 of thespring plate 610 in the vertical direction. Accordingly, the first platepart 611 and the second plate part 612 may be covered by the firstbonding sheet 620, and the elastic members 614, 615, 616, and 617 may beexposed by the open area 623 of the first bonding sheet 620.

The first bonding sheet 620 may be formed of a double-sided adhesivefilm. The first bonding sheet 620 may be formed of an epoxy or acrylicadhesive or a thermosetting adhesive film.

The first bonding sheet 620 may have a thickness of 25 μm.

FIG. 5 is a view showing a first embodiment of the insulating layershown in FIG. 2, FIG. 6 is a view showing a second embodiment of theinsulating layer shown in FIG. 2, and FIG. 7 is a view showing a thirdembodiment of the insulating layer shown in FIG. 2.

Referring to FIG. 5, the insulating layer 630 is disposed on the firstbonding sheet 620. The insulating layer 630 may have a planar shapecorresponding to the planar shape of the first bonding sheet 620.

That is, the insulating layer 630 may include a first insulating part631 disposed on the first bonding part 621 and a second insulating part632 disposed on the second bonding part 622. In addition, the insulatinglayer 630 may include an open region 633 between the first insulatingpart 631 and the second insulating part 632.

The second insulating part 632 is disposed surrounding the firstinsulating part 631 at a position spaced apart from the first insulatingpart 631 by a predetermined distance. In this case, the secondinsulating part 632 does not directly contact the first insulating part631. Accordingly, the first insulating part 631 and the secondinsulating part 632 may be separated from each other through the openregion 633.

Meanwhile, the open region 633 of the insulating layer 630 may overlapthe open region 613 of the spring plate 610 in a vertical direction.Preferably, a planar area of the open region 633 of the insulating layer630 may be the same as the planar area of the open region 613 of thespring plate 610. In addition, the insulating layer 630 does not overlapwith the elastic members 614, 615, 616, 617 of the spring plate 610 inthe vertical direction. That is, the elastic members 614, 615, 616, and617 may be exposed through the open region 623 of the first bondingsheet 620 and the open region 633 of the insulating layer 630.

The insulating layer 630 may have a thickness of 20 μm to 100 μm. Forexample, the insulating layer 630 may have a thickness of 25 μm to 50μm. For example, the insulating layer 630 may have a thickness of 30 μmto 40 μm. When the thickness of the insulating layer 630 exceeds 100 μm,the overall thickness of the image sensor substrate 600 may increase.When the thickness of the insulating layer 630 is less than 20 μm, itmay be difficult to dispose the image sensor 700. When the thickness ofthe insulating layer 630 is less than 20 μm, it may be weak againstheat/pressure, or the like in a process of mounting the image sensor,and thus it may be difficult to mount the image sensor 700 stably.

Meanwhile, a second bonding sheet 640 is disposed on the insulatinglayer 630.

The second bonding sheet 640 has the same structure as the first bondingsheet 620. Compared to the first bonding sheet 620, the second bondingsheet 640 differs only in an arrangement position. Accordingly, adetailed description of the second bonding sheet 640 will be omitted.Meanwhile, although not shown in the drawing, the second bonding sheet640 also includes an open area like the first bonding sheet 620 or theinsulating layer 630, and accordingly, the elastic members 614, 615,616, 617 is exposed.

Meanwhile, in the insulating layer 630 in the first embodiment, thefirst insulating part and the second insulating part are separated fromeach other. That is, the open region 633 of the insulating layer 630 isdisposed to surround the entire circumference of the first insulatingportion 631.

On the other hand, the open region 633 of the insulating layer 630 maybe disposed partially surrounding the first insulating part 631.

FIG. 6, the insulating layer 630A in the second embodiment may includean insulating part 624 and a plurality of open holes 625A, 625B, 625C,and 625D disposed in the insulating part 624.

That is, in the first embodiment, the open region has a shape of oneclosed loop that is entirely disposed around the first insulating part.On the other hand, in the second embodiment, the plurality of open holes625A, 625B, 625C, and 625D are disposed at positions spaced apart fromeach other by a predetermined interval. Accordingly, the insulating part624 of the insulating layer 630A is not separated. In this case, theplurality of open holes 625A, 625B, 625C, and 625D may be formed on aregion overlapping the open region 613 of the spring plate 610. At thistime, a connection portion between the plurality of open holes 625A,625B, 625C, 625D is positioned on a region overlapping in the verticaldirection with the elastic members 614, 615, 616, 617 of the springplate 610. According to this embodiment, the elastic support force ofthe image sensor substrate 600 may be improved by increasing thestrength of the insulating layer 630A.

Also, referring to FIG. 7, the insulating layer 630B according to thethird embodiment may include a first insulating part 626, a secondinsulating part 627, and an elastic insulating part 628.

The elastic insulating part 628 may be integrally formed with the firstinsulating part 626 and the second insulating part 627. That is, when anopen region is formed in the insulating layer 630B, the entire peripheryof the first insulating part 626 is not opened, that is, a spring-likepattern may remain around the first insulating part 626. Accordingly,the elastic insulating part 628 of the embodiment may be formed. Theelastic insulating part 628 may be disposed on a region verticallyoverlapping the elastic members 614, 615, 616, 617 of the spring plate610. According to such an embodiment, the elasticity of the image sensorsubstrate 600 may be improved by increasing the strength of theinsulating layer 630B.

FIG. 8 is a view showing a pattern part shown in FIG. 2.

Referring to FIG. 8, the conductive pattern portion 650 may be disposedon the insulating layer 630 with a specific pattern. The conductivepattern portion 650 includes a first conductive pattern part 651disposed on a first region of the insulating layer 630, a secondconductive pattern part 652 disposed on a second region of theinsulating layer 630, a third conductive pattern part 653 disposed on athird region of the insulating layer 630, and a fourth conductivepattern part 654 disposed on a fourth region of the insulating layer630.

The first conductive pattern part 651 may be disposed on a left side ofan upper surface of the insulating layer 630. That is, the firstconductive pattern part 651 may be disposed on a left region of thefirst insulating part 631, a left region of the second insulating part632, and a left region of the open region 633.

The second conductive pattern art 652 may be disposed in a right regionof the upper surface of the insulating layer 630. That is, the secondconductive pattern part 652 may be disposed on a right region of thefirst insulating part 631, a right region of the second insulating part632, and a right region of the open region 633.

The third conductive pattern part 653 may be disposed in an upper regionof the upper surface of the insulating layer 630. That is, the thirdconductive pattern part 653 may be disposed on an upper region of thefirst insulating part 631, an upper region of the second insulating part632, and an upper region of the open region 633.

The fourth conductive pattern part 654 may be disposed in a lower regionof the upper surface of the insulating layer 630. That is, the fourthconductive pattern part 654 may be disposed on a lower region of thefirst insulating part 631, a lower region of the second insulating part632, and a lower region of the open region 633.

As described above, the conductive pattern portion 650 are disposed ondifferent regions, and accordingly, the elastic support force in themovement of the image sensor substrate 600 may be increased. That is,when the conductive pattern portion 650 is intensively disposed only ina specific area, reliability in moving the image sensor substrate 600 ina specific direction may be reduced. For example, when the conductivepattern portion 650 includes only the first and second conductivepattern parts, there is no problem with the movement of the image sensorsubstrate 600 in the X-axis direction, stability may be deterioratedwhen the image sensor substrate 600 moves in the Y-axis direction. Inaddition, in this case, the conductive pattern portion 650 may bedisconnected according to the periodic movement of the image sensorsubstrate 600. Accordingly, in the embodiment, the conductive patternportion 650 is distributed in each of the four regions as describedabove, so that the image sensor substrate 600 can be stably moved in theX-axis, Y-axis, and Z-axis.

Meanwhile, the conductive pattern portion 650 may include a first leadpattern part 655 connected to the image sensor 700 and a second leadpattern part 656 connected to the flexible circuit board 800. Inaddition, the conductive pattern portion 650 may include an extensionpattern part 657 connecting the first lead pattern part 655 and thesecond lead pattern part 656 to each other.

The first lead pattern part 655 is disposed on the first insulating part631 of the insulating layer 630. The first lead pattern part 655 may bedisposed in an outer region of the first insulating part 631. That is,the image sensor mounting area on which the image sensor 700 is mountedmay be formed in the first insulating part 631. In this case, the imagesensor mounting area may be a central area of the first insulating part631. Accordingly, the first lead pattern part 655 may be disposed aroundthe image sensor mounting area of the first insulating part 631.

The second lead pattern part 656 is disposed on the second insulatingpart 632 of the insulating layer 630. The second lead pattern parts 656may be respectively disposed on the second insulating part 632. In thiscase, the first lead pattern part 655 and the second lead pattern part656 may be disposed to face each other on the first insulating part 631and the second insulating part 632. That is, the number of first leadpattern parts 655 may be the same as the number of second lead patternparts 656. In addition, the first lead pattern parts 655 may be disposedto face the second lead pattern part 656, respectively.

Meanwhile, the extension pattern part 657 may be disposed between thefirst lead pattern part 655 and the second lead pattern part 656.

The extension pattern part 657 may have one end connected to the firstlead pattern part 655 and the other end connected to the second leadpattern part 656 facing the first lead pattern part 655.

In this case, the extension pattern part 657 may be disposed on the openregion of the insulating layer 630. Accordingly, the extension patternpart 657 may be disposed to float in the open region of the insulatinglayer, the open region of the first bonding sheet, the open region ofthe second bonding sheet, and the open region of the spring plate 610.Here, the meaning that the extension pattern part 657 is floating meansthat there is no support part supporting the extension pattern part 657at the bottom. Accordingly, the extension pattern part 657 may bedisposed in a state floating in the air.

A length of the extension pattern part 657 is greater than a lineardistance between the first lead pattern part 655 and the second leadpattern part 656. That is, the extension pattern part 657 may be formedto have a structure that is bent a plurality of times between the firstlead pattern part 655 and the second lead pattern part 656. Preferably,the extension pattern part 657 may be formed in a spring shape betweenthe first lead pattern part 655 and the second lead pattern part 656.

At this time, the extension pattern part 657 may be formed by etching tohave the above shape through an additive process, a subtractive process,a modified semi-additive process (MSAP), a semi-additive process (SAP),and the like. Preferably, the extension pattern part 657 may be formedsimultaneously with the first lead pattern part 655 and the second leadpattern part 656. More preferably, the extension pattern part 657 may beintegrally formed with the first lead pattern part 655 and the secondlead pattern part 656.

Meanwhile, the thickness of the conductive pattern portion 650 includingthe extension pattern part 657, the first lead pattern part 655, and thesecond lead pattern part 656 may be 10 μm to 50 μm. For example, thethickness of the conductive pattern portion 650 may be 30 μm to 40 μm.In this case, when the thickness of the conductive pattern portion 650is less than 10 μm, the conductive pattern portion 650 may be brokenwhen the image sensor substrate 600 moves. In addition, when thethickness of the conductive pattern portion 650 is greater than 50 μm,elastic force of the extension pattern part 657 may be lowered, therebyhindering the mobility of the image sensor substrate 600. Accordingly,in the embodiment, the thickness of the conductive pattern portion 650is set to be 35 μm±5 μm such that the image sensor substrate 600 may bestably moved.

In addition, the length of the extension pattern part 657 is set to haveat least 1.5 times the linear distance between the first lead patternpart 655 and the second lead pattern part 656. In addition, the lengthof the extension pattern part 657 is set to be 20 times or less of thelinear distance between the first lead pattern part 655 and the secondlead pattern part 656. Preferably, the length of the extension patternpart 657 is set to be less than 4 times the linear distance between thefirst lead pattern part 655 and the second lead pattern part 656.

The linear distance between the first lead pattern part 655 and thesecond lead pattern part 656 may be 1.5 mm.

In this case, when the length of the extension pattern part 657 issmaller than 1.5 times the linear distance between the first leadpattern part 655 and the second lead pattern part, the mobility of theimage sensor substrate 600 may be reduced due to the decrease in theelastic force of the extension pattern part 657. In addition, when thelength of the extension pattern part 657 is greater than 20 times thelinear distance, a resistance increases as a signal transmissiondistance is increased by the extension pattern part 657, andaccordingly, noise may be included in a signal transmitted via theextension pattern part 657. Accordingly, in order to minimize noisegeneration, the length of the extension pattern part 657 is set to be 4times or less the linear distance between the first lead pattern part655 and the second lead pattern part 656.

In addition, the length of the extension pattern part 657 is smallerthan the lengths of the elastic members 614, 615, 616, and 617.

Meanwhile, the conductive pattern portion 650 as described above is awiring for transmitting an electrical signal, and may be formed of ametal material having high electrical conductivity. For this, theconductive pattern portion 650 may be formed of at least one metalmaterial selected from among gold (Au), silver (Ag), platinum (Pt),titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn). In addition, theconductive pattern portion 650 may be formed of paste or solder pasteincluding at least one metal material selected from among gold (Au),silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), andzinc (Zn), which are excellent in bonding strength.

Preferably, the conductive pattern portion 650 serves as a wiring fortransmitting an electrical signal, and may be formed of a metallicmaterial having an elastic force movable in the X-axis, Y-axis, andZ-axis directions by interlocking with the elastic member. To this end,the conductive pattern portion 650 may be formed of a metal materialhaving a tensile strength of 1000 MPa or more. For example, theconductive pattern portion 650 may be a binary alloy or ternary alloycontaining copper. For example, the conductive pattern portion 650 maybe a binary alloy of copper (Cu)-nickel (Ni). For example, theconductive pattern portion 650 may be a binary alloy of copper (Cu)-tin(Sn). For example, the conductive pattern portion 650 may be a binaryalloy of copper (Cu)-beryllium (Be). For example, the conductive patternportion 650 may be a binary alloy of copper (Cu)-cobalt (Co). Forexample, the conductive pattern portion 650 may be a ternary alloy ofcopper (Cu)-nickel (Ni)-tin (Sn). For example, the conductive patternportion 650 may be a ternary alloy of copper (Cu)-beryllium (Be)-cobalt(Co). In addition, in addition to the metal material, the conductivepattern portion 650 may be formed of an alloy of iron (Fe), nickel (Ni),zinc (Zn), and the like having an elastic force capable of acting as aspring and having good electrical characteristics. Further, theconductive pattern portion 650 may be surface-treated with a platinglayer containing a metal material such as gold (Au), silver (Ag),palladium (Pd), and the like, thereby improving electrical conductivity.

FIG. 9 is a plan view of a substrate for an image sensor according tothe first embodiment.

Referring to FIG. 9, the first bonding sheet 620 is disposed on thespring plate 610. In addition, the insulating layer 630 is disposed onthe first bonding sheet 620. In addition, the second bonding sheet 630is disposed on the insulating layer 630. In addition, the conductivepattern portion 650 is disposed on the second bonding sheet 630. In thiscase, the spring plate 610, the first bonding sheet 620, the insulatinglayer 630, and the second bonding sheet 630 each include an open region,and each of the open regions may overlap each other in a verticaldirection. Therefore, the elastic members 614, 615, 616, 617 of thespring plate 610 disposed at a lowermost portion may be exposed throughthe open regions of the spring plate 610, the first bonding sheet 620,the insulating layer 630, and the second bonding sheet.

The extension pattern part 657 of the conductive pattern portion 650 isalso disposed on the open region of the spring plate 610, the firstbonding sheet 620, the insulating layer 630, and the second bondingsheet 630.

That is, the elastic members 614, 615, 616, 617 of the spring plate 610and the extension pattern part 657 of the conductive pattern portion 650are disposed in the open regions of the spring plate 610, the firstbonding sheet 620, and the insulating layer 630, and the second bondingsheet 630.

In this case, the elastic members 614, 615, 616, 617 of the spring plate610 and the extension pattern part 657 of the conductive pattern portion650 do not overlap each other in the vertical direction. For example,the elastic members 614, 615, 616, 617 of the spring plate 610 aredisposed in a first region of the open regions of the spring plate 610,the first bonding sheet 620, the insulating layer 630, the secondbonding sheet 630. And, the extension pattern part 657 of the conductivepattern portion 650 is disposed in a second region of the open regionsof the spring plate 610, the first bonding sheet 620, the insulatinglayer 630, and the second bonding sheet 630. The first region of theopen regions may be a corner region of the open regions, and the secondregion of the open regions may be a remaining area except for the cornerregion.

That is, the image sensor substrate 600 not only moves in the X-axisdirection and the Y-axis direction, but also moves in the Z-axisdirection. At this time, there is a difference between the elasticmodulus of the elastic members 614, 615, 616, and 617 and the elasticmodulus of the extension pattern part 657. Accordingly, when the imagesensor substrate 600 moves in the Z-axis direction, the movementdistances of the elastic members 614, 615, 616, 617 and the extensionpattern part 657 appear different from each other. Accordingly, when theimage sensor substrate 600 moves in the Z-axis direction, the elasticmembers 614, 615, 616, 617 and the extension pattern part 657 maycontact each other. Accordingly, a problem (for example, a short) mayoccur in electrical reliability. Accordingly, in the embodiment, asdescribed above, the elastic members 614, 615, 616, 617 and theextension pattern part 657 are not aligned with each other in thevertical direction. Thereby, the electrical reliability problem can besolved.

FIG. 10 is a view showing a connection structure between a flexiblecircuit board and an image sensor board according to the firstembodiment.

Referring to FIG. 10, the flexible circuit board 800 electricallyconnects the image sensor substrate 600 and an external main substrate(not shown) to each other.

One end of the flexible circuit board 800 may be connected to the imagesensor substrate 600. The flexible circuit board 800 may receive anelectrical signal output from the image sensor 700. The flexible circuitboard 800 may have a connector 810 at the other end. A main board (notshown) may be connected to the connector 810.

That is, the flexible circuit board 800 may connect the camera moduleand the main board of the external device. Specifically, the flexiblecircuit board 800 may connect between the conductive pattern portion 650of the image sensor substrate 600 of the camera module and the mainboard of a portable terminal.

To this end, an area of the flexible circuit board 800 is disposedinside the housing 300, and accordingly, may be connected to theconductive pattern portion 650 of the image sensor substrate 600.

That is, the flexible circuit board 800 may include a first connectorpart 801, a second connector part 803, and a connection part 802.

The first connector part 801 may be disposed inside the housing 300. Thefirst connector part 801 may include a plurality of pads 804, 805, 806,and 807 connected to the conductive pattern portion 650.

The first connector part 801 may be electrically connected to the secondlead pattern part 656 of the conductive pattern portion 650. That is,the plurality of pads 804, 805, 806, and 807 of the first connector part801 may be electrically connected to the second lead pattern part 656.

To this end, the first connector part 801 may include a first pad part804 connected to the second lead pattern part 656 of the firstconductive pattern part 651. In addition, the first connector part 801may include a second pad part 805 connected to the second lead patternpart 656 of the second conductive pattern part 652. In addition, thefirst connector part 801 may include a third pad part 806 connected tothe second lead pattern part 656 of the third conductive pattern part653. In addition, the first connector part 801 may include a fourth padpart 807 connected to the second lead pattern part 656 of the fourthconductive pattern part 654.

In this case, the first connector part 801 has a shape corresponding tothe second insulating part 632 of the insulating layer 630. Accordingly,the first connector part 801 may be disposed surrounding an upper areaof the second lead pattern part 656 of the conductive pattern portion650, and the plurality of pads 804, 805, 806, and 807 may be disposed ona lower surface of the first connector part 801.

The connection part 802 connects the first connector part 801 and thesecond connector part 803 to each other. A part of the connection part802 may be disposed in the housing 300, and may be extended therefrom tobe exposed to the outside of the housing 300.

The second connector part 803 may include a connector 810 connected tothe main board of the terminal.

Meanwhile, the image sensor 1700 may be attached on the first insulatingpart 1631 of the insulating layer 1610.

In this case, an electrode 710 of the image sensor 700 faces upward andmay be attached to the first insulating part 631. In addition, aconnection member 720 such as a metal wire is formed between theelectrode 710 of the image sensor 700 and the first lead pattern part655. The connection member 720 may electrically connect the electrode ofthe image sensor and the first lead pattern part.

FIG. 11 is a diagram specifically illustrating a layer structure of aconductive pattern portion according to the first embodiment.

Referring to FIG. 11, the conductive pattern portion 650 is disposed onthe second bonding sheet 640 disposed on the insulating layer 630. Inthis case, the conductive pattern portion 650 includes the first leadpattern part 655 disposed on the first insulating part 631 of theinsulating layer 630, the second lead pattern part 656 on the secondinsulating part 632, and the extension pattern part 657 connectingtherebetween.

In this case, each of the first lead pattern part 655, the second leadpattern part 656, and the extension pattern part 657 may include a metallayer 650A and a plating layer 650B.

The metal layer 650A may be disposed on the second bonding sheet 640.That is, the metal layer 650A is disposed on the second bonding sheet640 to configure the first lead pattern part 655, the second leadpattern part 656, and the extension pattern part 657, respectively.

The plating layer 650B may be disposed on the metal layer 650A.Preferably, the plating layer 650B may be a surface treatment layerdisposed on the metal layer 650A.

The plating layer 650B includes any one of Ni/Au alloy, gold (Au),electroless nickel immersion gold (ENIG), Ni/Pd alloy, and organiccompound plating (Organic Solderability Preservative, OSP).

In this case, the plating layers 650B constituting the first leadpattern part 655 and the second lead pattern part 656 may correspond toeach other. Alternatively, the plating layer 650B constituting theextension pattern part 657 may have a thickness different from that ofthe plated layer 650B constituting the first lead pattern part 655 andthe second lead pattern part 656.

That is, the plating layer 650B of the first lead pattern part 655 andthe second lead pattern part 656 may be selectively formed only on upperand side surfaces of the corresponding metal layer 650A. In contrast,the metal layer 650A constituting the extension pattern part 657 isdisposed in a floating state on the above-described open region.Accordingly, the plating layer 650B of the extension pattern part 657may be formed to surround the entire surface of the corresponding metallayer 650A. That is, the plating layer 650B of the extension patternpart 657 may be formed to surround the upper, side, and lower surfacesof the metal layer 650A of the extension pattern part 657.

Accordingly, the lower surface of the first lead pattern part 655 andthe upper surface of the spring plate 610 may be spaced apart by a firstdistance. In addition, the lower surface of the second lead pattern part656 and the upper surface of the spring plate 610 may be spaced apart bythe first distance. In addition, the lower surface of the extensionpattern part 657 and the spring plate 610 may be spaced apart by asecond distance smaller than the first distance due to the platinglayer.

Meanwhile, the thickness of the plating layer 650B may be 0.3 μm to 1μm. For example, the thickness of the plating layer 650B may be 0.3 μmto 0.7 μm. The thickness of the plating layer 650B may be 0.3 μm to 0.5μm.

FIG. 12 is a diagram showing a modified example of the camera module.

Referring to FIG. 12, the image sensor may be attached to the imagesensor substrate 600 in a flip chip bonding method.

That is, after the image sensor in the previous embodiment is attachedon the insulating layer 630, the first lead pattern part 655 and theelectrode 710 of the image sensor 700 are mutually connected by wirebonding through a connection member.

Alternatively, the image sensor may be mounted on the package substrate,and accordingly, the image sensor may be mounted on the image sensorsubstrate 600 on the insulating layer 630 in a flip chip bonding method.

The package substrate 900 may include an insulating layer 910, a circuitpattern 920, a via 930, an image sensor 940, a connection member 950, aprotection member 960, and an adhesive member 970.

The image sensor 940 may be electrically connected to the circuitpatterns 920 respectively disposed on the upper and lower surfaces ofthe insulating layer 910 through the connection member 950. Further, thevia 930 may electrically connect the circuit patterns 920 disposed onthe upper and lower surfaces of the insulating layer 910 to each other.

The protection member 960 may be disposed on the lower surface of theinsulating layer 910 to protect the lower surface of the insulatinglayer 910 and expose at least a part of the circuit pattern 920. Inaddition, an adhesive member 970 may be disposed on the circuit patternexposed through the protection member 960. The adhesive member 970 maybe a solder ball. The adhesive member 970 may contain materials ofheterogeneous components in solder. The solder may be composed of atleast one of SnCu, SnPb, and SnAgCu. In addition, the material of theheterogeneous component may include any one of Al, Sb, Bi, Cu, Ni, In,Pb, Ag, Sn, Zn, Ga, Cd, and Fe.

Meanwhile, in a state in which the package substrate 900 as describedabove is manufactured, the adhesive member 970 may be connected to thefirst lead pattern part 655.

FIG. 13 is a view showing a X-axis displacement simulation of a springplate according to the first embodiment, FIG. 14 is a view showing aY-axis displacement simulation of a spring plate according to the firstembodiment, FIG. 15 is a view showing a Z-axis displacement simulationof a spring plate according to the first embodiment, and FIG. 16 is aview showing a tilt axis displacement simulation of a spring plateaccording to the first embodiment.

Referring to FIGS. 13 and 16, reliability in the X-axis, Y-axis, Z-axisand tilt operation of the image sensor substrate 600 was evaluated bythe spring plate 610 according to the embodiment. As a result of this,it was confirmed that the image sensor substrate 600 was stablysupported for all movement directions, and it was confirmed thatsufficient stress was maintained.

The results of the X-axis displacement simulation according to theembodiment are shown in Table 1.

TABLE 1 condition data unit Force 10 mN displacement 3.23 mm stress 409MPa spring constant 3.10 mM/mm

The results of the Y-axis displacement simulation according to theembodiment are shown in Table 2.

TABLE 2 condition data unit Force 10 mN displacement 3.81 mm stress 439MPa spring constant 2.62 mM/mm

The results of the Z-axis displacement simulation according to anembodiment are shown in Table 3.

TABLE 3 condition data unit Force 10 mN displacement 12.12 mm stress 663MPa spring constant 0.83 mM/mm

The tilt displacement simulation results according to the embodiment areshown in Table 4 below.

TABLE 4 condition data unit Force 5*2 (

) mN displacement 22.4 (1.26) ° (mm) stress 237 MPa

FIG. 17 is a view showing a camera device according to an embodiment.

Referring to FIG. 17, the camera device according to the embodimentincludes a lens barrel 1100, a lens assembly 1200, a housing 1300, aninfrared cut filter part 1400, a driving part 1510, 1520, 1530, an imagesensor substrate 1600, an image sensor 1700, and a flexible circuitboard 1800.

In the following description, a detailed description of theconfiguration substantially the same as that of FIG. 2 will be omitted.

Here, the lens barrel 110, the lens assembly 1200, the housing 1300, theinfrared cut filter part 1400, the driving part (1510, 1520, 1530), theimage sensor 1700, and the flexible circuit board 1800 are substantiallythe same as the corresponding configuration in FIG. 2, and a detaileddescription thereof will be omitted.

The image sensor substrate 1600 is a substrate on which the image sensor1700 is mounted. Specifically, the image sensor substrate 1600 may bedriven by the driving parts 1510, 1520, and 1530 to move the imagesensor 1700 in the X-axis, Y-axis and Z-axis directions. In addition,the image sensor substrate 1600 may be driven by the driving parts 1510,1520, and 1530 to tilt the image sensor 1700.

The image sensor substrate 1600 may be disposed to be spaced apart froma bottom surface of the housing 1300 at a predetermined interval. Inaddition, the image sensor substrate 1600 may move the image sensor 1700relative to the housing 1300.

To this end, the image sensor substrate 1600 may include an insulatinglayer 1610, a first bonding sheet 1620, a conductive pattern portion1640, and a supporting layer 1650. In addition, according to anembodiment, the image sensor substrate 1600 may further include a secondbonding sheet 1630. That is, the second bonding sheet 1630 may beselectively disposed between the insulating layer 1610 and theconductive pattern portion 1640. If the second bonding sheet isincluded, the plane area of the second bonding sheet in one embodimentmay be the same as the plane area of the insulating layer 1610, and theplane area of the second bonding sheet in another embodiment may be thesame as the plane area of the conductive pattern portion 1640. This willbe described with reference to FIGS. 25 and 26A and 26B.

The insulating layer 1610 may support the conductive pattern portion1640 and move the image sensor 1700 disposed on the image sensorsubstrate 1600 in the X-axis, Y-axis, and Z-axis directions. To thisend, the insulating layer 1610 may include an elastic region having acertain elastic force. Preferably, the insulating layer 1610 may includea plurality of elastic regions. For example, the insulating layer 1610may include four elastic regions.

That is, at least one region of the insulating layer 1610 may have acertain elastic force, Accordingly, the image sensor substrate 1600 maybe moved in the X-axis, Y-axis, and Z-axis directions while elasticallysupporting the image sensor substrate 1600.

A conductive pattern portion 1640 is disposed on the insulating layer1610. The conductive pattern portion 1640 may include a lead patternpart spaced apart from each other by a predetermined interval on theinsulating layer 1610. For example, the conductive pattern portion 1640may include a first lead pattern part connected to the image sensor 1700and a second lead pattern part connected to the flexible circuit board1800. In addition, the conductive pattern portion 1650 may include anextension pattern part connecting the first lead pattern part and thesecond lead pattern part. The first lead pattern part, the second leadpattern part, and the extension pattern part will be described in detailbelow.

In addition, the insulating layer 1610 may include a first insulatingpart in which the first lead pattern part is disposed, a secondinsulating part in which the second lead pattern part is disposed, andan extension insulating part in which the extension pattern part isdisposed. The first insulating part, the second insulating part, and theextension insulating part will be described in more detail below.

Meanwhile, a second bonding sheet 1630 may be disposed between theinsulating layer 1610 and the conductive pattern portion 1640. Thesecond bonding sheet 1630 may provide adhesive force between theinsulating layer 1610 and the conductive pattern portion 1640. In thiscase, the second bonding sheet 1630 may have a shape corresponding tothe insulating layer 1610. To this end, the second bonding sheet 1630may include an elastic region having an elastic force corresponding tothe insulating layer 1610. For example, the second bonding sheet 1630may include a first bonding part, a second bonding part, and anextension bonding part between the first bonding part and the secondbonding part.

The first bonding part of the second bonding sheet 1630 may be disposedbetween the first insulating part and the first lead pattern part.

The second bonding part of the second bonding sheet 1630 may be disposedbetween the second insulating part and the second lead pattern part.

In addition, the extension bonding part of the second bonding sheet 1630may be disposed between the extension insulating part and the extensionpattern part.

The image sensor substrate according to the embodiment provides elasticforce in the extension insulating part of the insulating layer 1610, theextension bonding part of the second bonding sheet 1630, and theextension pattern part of the conductive pattern portion 1640, and theimage sensor 1700 can be moved. Preferably, the extension insulatingpart, the extension bonding part, and the extension pattern part mayalso be referred to as an elastic member. In addition, the elasticmember may have a layered structure including an insulating layerregion, a bonding layer region, and a pattern layer region. This will bedescribed in more detail below.

In addition, the second bonding sheet 1630 may be omitted for the imagesensor substrate according to the embodiment. For example, theconductive pattern portion 1640 may be directly disposed on theinsulating layer 1610 without the second bonding sheet 1630. That is,the upper surface of the extension insulating part and the lower surfaceof the extension pattern part may directly contact each other withoutthe extension bonding part of the insulating layer 1610. Accordingly, inan embodiment, only the extension insulating part and the extensionpattern part may serve as the elastic member without the extensionbonding part.

The supporting layer 1650 may be a support substrate. A third drivingpart 1530 may be mounted on the supporting layer 1650, and accordingly,an electric signal may be applied to the third driving part 1530.

In addition, the third driving part 1530 may include an electromagnet,and thus may be mounted on the housing.

The supporting layer 1650 may support the insulating layer 1610.Preferably, the supporting layer 1650 may support the first bondingsheet 1620, the second bonding sheet 1630, the insulating layer 1610,the conductive pattern portion 1640 and the image sensor 1700 at aposition floating from the bottom surface of the housing 1300.

The image sensor 1700 is disposed on the image sensor substrate 1600,

One end of the flexible circuit board 1800 may be connected to the imagesensor substrate 1600.

To this end, a part of a region of the flexible circuit board 1800 isdisposed inside the housing 1300, and accordingly, may be connected tothe conductive pattern portion 1640 of the image sensor substrate 1600.

Hereinafter, the substrate 1600 for an image sensor according to thesecond embodiment will be described in more detail.

FIG. 18 is a view showing the insulating layer shown in FIG. 17.

Referring to FIG. 18, the insulating layer 1610 may elastically supportthe conductive pattern portion 1640 constituting the image sensorsubstrate 1600.

The insulating layer 1610 may have an elastic region having a certainelastic force to move the image sensor 1700 disposed on the image sensorsubstrate 1600 in the X-axis, Y-axis, and Z-axis directions.

To this end, the elastic region may include the extension insulatingpart 1614 having an elastic force of the insulating layer 1610.Specifically, the first insulating part 1611 may be disposed in thecenter of the insulating layer 1610. In addition, the second insulatingpart 1612 may be disposed around the first insulating part 1611 at aposition spaced apart from the first insulating part 1611 by apredetermined distance.

In addition, the insulating layer 1610 may include the first insulatingpart 1611 and the second insulating part 1612, and an open region can bebetween the include the first insulating part 1611 and the secondinsulating part 1612. Preferably, the first insulating part 1611 and thesecond insulating part 1612 may be spaced apart from each other by theopen region 1613 interposed therebetween.

In addition, the extension insulating part 1614 may have one endconnected to the first insulating part 1611 and the other end connectedto the second insulating part 1612. To this end, the extensioninsulating part 1614 may be formed in plural. Preferably, the extensioninsulating part 1614 may include first to fourth extension insulatingparts 1614.

The first insulating part 1611 may include a plurality of outerportions. Preferably, the first insulating part 1611 may include a leftouter portion, a right outer portion, an upper outer portion, and alower outer portion.

The second insulating part 1612 may include a plurality of inner parts.Preferably, the second insulating part 1612 may include a left innerportion, a right inner portion, an upper inner portion, and a lowerinner portion.

In this case, the left outer portion of the first insulating part 1611and the left inner portion of the second insulating part 1612 may bedisposed to face each other. In addition, the first extension insulatingpart constituting the extension insulating part 1614 may connect theleft outer portion of the first insulating part 1611 and the left innerportion of the second insulating part 1612 to each other.

In addition, the right outer portion of the first insulating part 1611and the right inner portion of the second insulating part 1612 may bedisposed to face each other. In addition, the second extensioninsulating part constituting the extension insulating part 1614 mayconnect the right outer portion of the first insulating part 1611 andthe right inner portion of the second insulating part 1612 to eachother.

In addition, the upper outer portion of the first insulating part 1611and the upper inner portion of the second insulating part 1612 may bedisposed to face each other. In addition, the third extension insulatingpart constituting the extension insulating part 1614 may connect theupper outer portion of the first insulating part 1611 and the upperinner portion of the second insulating part 1612 to each other.

In addition, the lower outer portion of the first insulating part 1611and the lower inner portion of the second insulating part 1612 may bedisposed to face each other. In addition, the fourth extensioninsulating part constituting the extension insulating part 1614 mayconnect the lower outer portion of the first insulating part 1611 andthe lower inner portion of the second insulating part 1612 to eachother.

In addition, the first insulating part 1611, the second insulating part1612, and the extension insulating part 1614 may be integrally formed.Accordingly, it is possible to further utilize the elastic force of theinsulating layer 1610 when the image sensor is tilted, and it ispossible to prevent detachment between the first insulating part 1611,the extension insulating part 1614, and the second insulating part 1612.

That is, the insulating layer 1610 may be etched or physically punchedto have a spring shape of the extension insulating part 1614 on oneinsulating member to form the open region 1613. Accordingly, the firstinsulating part 1611, the second insulating part 1612, and the extensioninsulating part 1614 may be formed of the same insulating material.However, the embodiment is not limited thereto.

In other words, each of the first insulating part 1611, the secondinsulating part 1612, and the extension insulating part 1614 may beformed in separate configurations. That is, the insulating layer 1610according to the embodiment may be formed by further forming aconfiguration corresponding to the extension insulating part 1614between the first insulating part 1611 and the second insulating part1612, after preparing the first insulating part 1611 and the secondinsulating part 1614.

On the other hand, the length of the extension insulating part 1614 isset to have at least 1.5 times the linear distance between the firstinsulating part 1611 and the second insulating part 1612. In addition,the length of the extension insulating part 1614 is set to be 20 timesor less than the linear distance between the first insulating part 1611and the second insulating part 1614. Preferably, the length of theextension insulating part 1614 is set to be less than 4 times the lineardistance between the first insulating part 1611 and the secondinsulating part 1612.

Here, the linear distance may mean a distance between an outer surfaceand an inner surface facing each other in the first insulating part 1611and the second insulating part 1612. Preferably, the linear distance maybe a distance between the left outer surface of the first insulatingpart 1611 and the left inner surface of the second insulating part 1612.In addition, the linear distance may be a distance between the rightouter surface of the first insulating part 1611 and the right innersurface of the second insulating part 1612. Also, the linear distancemay be a distance between an upper outer surface of the first insulatingpart 1611 and an upper inner surface of the second insulating part 1612.Also, the linear distance may be a distance between a lower outersurface of the first insulating part 1611 and a lower inner surface ofthe second insulating part 1612.

Meanwhile, a linear distance between the first insulating part 1611 andthe second insulating part 1612 may be 1.5 mm. At this time, if lessthan 1.5 times the linear distance between the first insulating part1614 and the second insulating part 1612 of the extension insulatingpart 1614, the mobility of the image sensor substrate 1600 may bereduced due to the decrease in elastic force of the extension insulatingpart 1614. In addition, if the length of the extension insulating part1614 is greater than 20 times the linear distance between the firstinsulating part 1614 and the second insulating part 1612, an imagesensor 1700 disposed on the insulating layer 1610 cannot be stablysupported, and thus a problem may occur in movement accuracy.Accordingly, in the embodiment, in order to improve mobility, the lengthof the extension insulating part 1614 is set to be less than 4 times thelinear distance between the first insulating part 1611 and the secondinsulating part 1612.

Accordingly, the extension insulating part 1614 may be formed to have aplurality of bent spring shapes in the open region 1613.

Meanwhile, at least one slit (not shown) may be formed in the firstinsulating part 1611 of the insulating layer 1610. The slit may beformed to maintain flatness of the insulating layer 1610. That is, theconductive pattern portion 1640 and the image sensor 1700 are disposedon the insulating layer 1610. In addition, a first driving part isdisposed under the insulating layer 1610. In this case, the flatness ofthe first driving part or the image sensor 1700 directly affects thereliability of the camera module, and image quality may deteriorate asthe flatness deteriorates. Accordingly, in the embodiment, by forming atleast one slit in the insulating layer 1610, not only the weight of theinsulating layer 1610 is reduced, but also the flatness can bemaintained, thereby improving the overall reliability of the cameramodule.

FIG. 19 is a view showing a modified example of the conductive patternportion shown in FIG. 17.

Referring to FIG. 19, the insulating layer 1610A may include aninsulating part 1611 and a plurality of open holes 1613A, 1613B, 1613C,and 1613D disposed in the insulating part 1611.

That is, in the first embodiment, the open region has a shape of oneclosed loop that is entirely disposed around the first insulating part.In contrast, in the second embodiment, a plurality of open holes 1613A,1613B, 1613C, and 1613D are disposed at positions spaced apart from eachother by a predetermined interval, so that the first and secondinsulating parts of the insulating layer 1610A are not separated fromeach other. In this case, the previously described extension insulatingpart 1614 may be disposed in the plurality of open holes 1613A, 1613B,1613C, and 1613D.

In conclusion, in the modified example, the corner regions between thefirst and second insulating parts are interconnected, and open regionsare formed only in the remaining regions excluding the corner regions.In addition, the extension insulating part 1614 is disposed in the openregion. Accordingly, in a modified example, while improving the supportforce of the image sensor 1700 due to the increase in the strength ofthe insulating layer 1610, the reliability of mobility by the extensioninsulating part 1614 may be improved.

FIG. 20 is a view showing a second bonding sheet shown in FIG. 17.

Referring to FIG. 20, the second bonding sheet 1630 is disposed on theinsulating layer 1610. In this case, the second bonding sheet 1630 has aplanar shape corresponding to the planar shape of the insulating layer1610.

That is, the second bonding sheet 1630 may include a first bonding part1631 disposed on the first insulating part 1611 of the insulating layerand a second bonding part 1632 disposed on the second insulating part1612 of the insulating layer 1610. In addition, the second bonding sheet1630 may include an open region 1633 between the first bonding part 1631and the second bonding part 1632.

The second bonding part 1632 is disposed to surround the first bondingpart 1631 at a position spaced apart from the first bonding part 1631 bya predetermined distance. In this case, the second bonding part 1632does not directly contact the first bonding part 1631. Accordingly, thefirst bonding part 1631 and the second bonding part 1632 may beseparated from each other through the open region 1633.

In addition, the extension bonding part 1634 connecting between thefirst bonding part 1631 and the second bonding part 1632 is disposed inthe open region 1633. The extension bonding part 1634 has a shapecorresponding to the extension insulating part 1614. The extensionbonding part 1634 may be disposed in a region vertically overlapping theextension insulating part 1614. In this case, the extension bonding part1634 may have a plane area corresponding to the extension insulatingpart 1614. Preferably, the plane area of the extension bonding part 1634may be 0.9 to 1.1 times the plane area of the extension insulating part1614. The extension bonding part 1634 of the second bonding sheet 1630may be formed through the same process as the extension insulating part1614 of the insulating layer 1610. Accordingly, the extension bondingpart 1634 may have the same shape as the extension insulating part 1614and have the same plane area.

The second bonding sheet 1630 may be formed of a double-sided adhesivefilm. The second bonding sheet 1630 may be formed of an epoxy or acrylicadhesive or a thermosetting adhesive film.

The second bonding sheet 1630 may have a thickness of 25 μm.

Meanwhile, a first bonding sheet 1610 is disposed under the insulatinglayer 1610. In this case, the first bonding sheet 1610 is disposed underthe second insulating part 1612 of the insulating layer 1610. In otherwords, the first bonding sheet 1610 may be selectively formed only in aregion of the lower surface of the insulating layer 1610 in which thesupporting layer 1650 is disposed. Meanwhile, the supporting layer 1650and the insulating layer 1610 may be integrally formed with each other.Accordingly, the first bonding sheet 1610 may be selectively omitted.

That is, the supporting layer 1650 may be formed by removing a portionof the lower surface of the insulating member constituting theinsulating layer 1610 and the supporting layer 1650 to form a groove.

FIG. 21 is a view showing a conductive pattern portion shown in FIG. 17.

Referring to FIG. 21, the conductive pattern portion 1640 may bedisposed on the insulating layer 1610 with a specific pattern. Theconductive pattern portion 1640 includes a first conductive pattern part1641 disposed on a first region of the insulating layer 1610 and asecond conductive pattern part 1642 disposed on a second region of theinsulating layer 1610, a third conductive pattern part 1643 disposed ona third region of the insulating layer 1610, and a fourth conductivepattern part 1644 disposed on a fourth region of the insulating layer1610. In the drawing, a region vertically overlapping the firstinsulating part 1611 of the insulating layer 1610 and the first bondingpart 1631 of the second bonding sheet 1630 is referred to as ‘A’, aregion vertically overlapping the second insulating part 1612 of theinsulating layer 1610 and the second bonding part 1632 of the secondbonding sheet 1630 is referred to as ‘B’, and a region verticallyoverlapping the open region 1613 of the insulating layer 1610 and theopen region 1633 of the second bonding sheet 1630 is referred to as ‘C’.

The first conductive pattern part 1641 may be disposed on a left side ofan upper surface of the insulating layer 1610. That is, the firstconductive pattern part 1641 may be disposed on a left region of thefirst insulating part 1611, a left region of the second insulating part1612, and the first extension insulating part 1614 connecting these.Preferably, the first conductive pattern part 6410 may be disposed on apart of the second bonding sheet on the left region of the firstinsulating part 1611, a part of the second bonding sheet on the leftarea of the second insulating part 1612, and a part of the extensionbonding part connecting them to each other.

In addition, the first conductive pattern part 1641 may be disposed onthe insulating layer 1610 without the second bonding sheet 1630.

The second conductive pattern part 1642 may be disposed in a rightregion of an upper surface of the insulating layer 1610. That is, thesecond conductive pattern part 1642 may be disposed on a right region ofthe first insulating part 1611, a right region of the second insulatingpart 1612 and a second extension insulating part connecting these.

The third conductive pattern part 1643 may be disposed in an upperregion of the upper surface of the insulating layer 1610. That is, thethird conductive pattern part 1643 may be disposed on an upper region ofthe first insulating part 1611, an upper region of the second insulatingpart 1612, and a third extension insulating part connecting these.

The fourth conductive pattern part 1644 may be disposed in a lowerregion of the upper surface of the insulating layer 1610. That is, thefourth conductive pattern part 1644 may be disposed on a lower region ofthe first insulating part 1611, a lower region of the second insulatingpart 1612, and a fourth extension insulating part connecting these.

As described above, the conductive pattern portions 1640 arerespectively disposed on different regions, and accordingly, the elasticsupport force in the movement of the image sensor substrate 1600 may beincreased. That is, if the conductive pattern portion 1640 isintensively disposed only in a specific area, reliability in moving theimage sensor substrate 1600 in a specific direction may be lowered. Forexample, if the conductive pattern portion 1640 includes only the firstand second conductive pattern portions, there is no problem with themovement of the image sensor substrate 1600 in the X-axis direction,stability may be deteriorated when the image sensor substrate 1600 movesin the Y-axis direction. In addition, in this case, the conductivepattern portion 1640 may be disconnected according to the periodicmovement of the image sensor substrate 1600. Accordingly, in theembodiment, the conductive pattern portion 1640 is distributed in eachof the four regions as described above, so that the image sensorsubstrate 1600 can be stably moved in the X-axis, Y-axis, and Z-axis.That is, the conductive pattern portion may be formed to be symmetricalup/down/left/right on the insulating layer 1610.

Meanwhile, the conductive pattern portion 1640 may include a first leadpattern part 1645 connected to the image sensor 1700 and a second leadpattern part 1646 connected to the flexible circuit board 1800. Inaddition, the conductive pattern portion 1640 may include an extensionpattern part 1647 connecting between the first lead pattern part 1645and the second lead pattern part 1646.

The first lead pattern part 1645 is disposed on the first insulatingpart 1611 of the insulating layer 1610. The first lead pattern part 1645may be disposed on an outer region of the first insulating part 1611.That is, the image sensor mounting area on which the image sensor 1700is mounted may be included on the first insulating part 1611. In thiscase, the image sensor mounting area may be a central area of the firstinsulating part 1611. Accordingly, the first lead pattern part 1645 maybe disposed around the image sensor mounting area of the firstinsulating part 1611.

The second lead pattern part 1646 is disposed on the second insulatingpart 1612 of the insulating layer 1610. The second lead pattern parts1646 may be disposed on the second insulating part 1612, respectively.In this case, the first lead pattern part 1645 and the second leadpattern part 1646 may be disposed to face each other on the firstinsulating part 1611 and the second insulating part 1612. That is, thenumber of first lead pattern parts 1645 may be the same as the number ofsecond lead pattern parts 1646. In addition, each of the first leadpattern parts 1645 may be disposed to face the second lead pattern part1646, respectively.

Meanwhile, the extension pattern part 1647 may be disposed between thefirst lead pattern part 1645 and the second lead pattern part 1646.

The extension pattern part 1647 may have one end connected to the firstlead pattern part 1645 and the other end connected to the second leadpattern part 1646 facing the first lead pattern part 1645.

In this case, the extension pattern part 1647 may be disposed on theextension insulating part 1614 of the insulating layer 1610. Preferably,the extension pattern part 1647 may be disposed on the extension bondingpart 1634 disposed on the extension insulating part 1614. Preferably,the extension bonding part 1634 may be disposed between the extensioninsulating part 1614 and the extension pattern part 1647. In addition,the upper surface of the extension bonding part 1634 may directlycontact the lower surface of the extension pattern part 1647. Inaddition, the lower surface of the extension bonding part 1634 maydirectly contact the extension insulating part 1614. Preferably, theextension pattern part 1647, the extension insulating part 1614, and theextension bonding part 1634 may be overlapped and aligned in a mutuallyvertical direction.

The length of the extension pattern part 1647 is greater than a lineardistance between the first lead pattern part 1645 and the second leadpattern part 1646. That is, the extension pattern part 1647 may beformed to have a structure that is bent a plurality of times between thefirst lead pattern part 1645 and the second lead pattern part 1646.Preferably, the extension pattern part 1647 may be formed to have aspring shape between the first lead pattern part 1645 and the secondlead pattern part 1646.

At this time, the extension pattern part 1647 may be formed by etchingto have the above shape through an additive process, a subtractiveprocess, a modified semi-additive process (MSAP), a semi-additiveprocess (SAP), and the like. Preferably, the extension pattern part 1647may be formed simultaneously with the first lead pattern part 1645 andthe second lead pattern part 656. More preferably, the extension patternpart 1647 may be integrally formed with the first lead pattern part 1645and the second lead pattern part 1646.

Meanwhile, the thickness of the conductive pattern portion 1640including the extension pattern part 1647, the first lead pattern part1645, and the second lead pattern part 1646 may be 10 μm to 50 μm. Forexample, the thickness of the conductive pattern portion 1640 may be 30μm to 40 μm. In this case, when the thickness of the conductive patternportion 1640 is less than the conductive pattern portion 1640 may bebroken when the image sensor substrate 1600 moves. In addition, when thethickness of the conductive pattern portion 1640 is greater than 50 μm,elastic force of the extension pattern part 1647 may be lowered, therebyhindering the mobility of the image sensor substrate 1600. Accordingly,in the embodiment, the thickness of the conductive pattern portion 1640is set to be 35 μm±5 μm such that the image sensor substrate 1600 may bestably moved.

In addition, the length of the extension pattern part 1647 is set tohave at least 1.5 times the linear distance between the first leadpattern part 1645 and the second lead pattern part 1646. In addition,the length of the extension pattern part 1647 is set to be 20 times orless of the linear distance between the first lead pattern part 1645 andthe second lead pattern part 1646. Preferably, the length of theextension pattern part 1647 is set to be less than or equal to 4 timesthe linear distance between the first lead pattern part 1645 and thesecond lead pattern part 1646.

The linear distance between the first lead pattern part 1645 and thesecond lead pattern part 1646 may be 1.5 mm.

In this case, when the length of the extension pattern part 1647 issmaller than 1.5 times the linear distance between the first leadpattern part 1645 and the second lead pattern part, the mobility of theimage sensor substrate 1600 may be reduced due to the decrease in theelastic force of the extension pattern part 1647. In addition, when thelength of the extension pattern part 1647 is greater than 20 times thelinear distance, a resistance increases as a signal transmissiondistance is increased by the extension pattern part 1647, andaccordingly, noise may be included in a signal transmitted via theextension pattern part 1647. Accordingly, in order to minimize noisegeneration, the length of the extension pattern part 1647 is set to be 4times or less the linear distance between the first lead pattern part1645 and the second lead pattern part 164.

Meanwhile, the line width of the extension pattern part 1647 may besmaller than the line width of the extension insulating part 1614.Accordingly, the extension insulating part 1614 may include a firstregion overlapping with the extension pattern part 1647 in a verticaldirection, and a second region excluding the first region. In this case,when the line width of the extension pattern part 1647 is smaller thanthe line width of the extension insulating part 1614, the lower surfaceof the extension pattern part 1647 may be exposed as the lower surfaceof the insulating layer 1610. In addition, due to such exposure, theextension pattern part 1647 may contact other components while the imagesensor 1700 is moving, and thus reliability may be problematic.Accordingly, in the embodiment, the line width of the extensioninsulating part 1614 is larger than the line width of the extensionpattern part 1647 disposed thereon.

FIG. 22 is a plan view of a substrate for an image sensor according to asecond embodiment.

Referring to FIG. 22, the conductive pattern portion 1640 is disposed onthe insulating layer 1610. In this case, an open region is formed ineach of the insulating layers 1610. In addition, the second bondingsheet 1630 may be disposed on the insulating layer 1610. In addition,the conductive pattern portion 1640 is disposed on the second bondingsheet 1630. In this case, open regions are formed in each of theinsulating layer 1610 and the second bonding sheet 1630, and the openregions may overlap each other in a vertical direction.

In addition, an elastic member having an elastic force may be disposedin each of the open regions. Here, the elastic member may be a part ofthe insulating layer 1610, or a part of the insulating layer 1610 and apart of the second bonding sheet 1630. That is, the elastic member maybe formed as a part of the insulating layer 1610 or/and the secondbonding sheet 1630. That is, the extension insulating part 1614 having abent shape that is bent a plurality of times is disposed in the openregion of the insulating layer 1610. The extension insulating part 1614may have a spring shape. In addition, an extension bonding part 1634having a bent shape that is bent a plurality of times is disposed in theopen region of the second bonding sheet 1630. The extension bonding part1634 may have a spring shape.

In addition, the extension bonding part 1634 and the extensioninsulating part 1614 may have the same shape while having the sameplanar area.

Meanwhile, each of line widths of the extension bonding part 1634 andthe extension insulating part 1614 may be larger than the line width ofthe extension pattern part 1647. Accordingly, when the image sensorsubstrate is viewed from above, at least a part of the extension bondingpart 1634 and the extension insulating part 1614 positioned under theextension pattern part 1647 may be exposed.

At this time, the image sensor substrate 1600 may move not only in theX-axis direction and the Y-axis direction, but also in the Z-axisdirection. At this time, there is a difference between the elasticmodulus of the extension bonding part 1634 and the extension insulatingpart 1614 and the elastic modulus of the extension pattern part 1647.Accordingly, when the image sensor substrate 1600 moves in the Z-axisdirection, the movement distances of the extension bonding part 1634 andthe extension insulating part 1614 may appear differently. In addition,this causes a situation in which the extension pattern part 1647 is incontact with a constituent portion of another metal material, therebycausing an electrical reliability problem (eg, a short). Accordingly, inthe embodiment, the line widths of the extension insulating part 1614and the extension insulating part 1614 are made larger than the linewidth of the extension pattern part 1647 as described above, so that theelectrical reliability problem can be solved.

FIG. 23 is a view showing a connection structure between a flexiblecircuit board and an image sensor board according to a secondembodiment.

Referring to FIG. 23, the flexible circuit board 1800 electricallyconnects the image sensor board 1600 and an external main board (notshown) to each other.

One end of the flexible circuit board 1800 may be connected to the imagesensor substrate 1600. The flexible circuit board 1800 may receive anelectrical signal output from the image sensor 1700. The flexiblecircuit board 1800 may include a connector 1810 at the other end. A mainboard (not shown) may be connected to the connector 1810.

That is, the flexible circuit board 1800 may connect the camera moduleand the main board of the external device. Specifically, the flexiblecircuit board 1800 may connect between the conductive pattern portion1650 of the image sensor substrate 1600 of the camera module and themain board of a portable terminal.

To this end, an area of the flexible circuit board 1800 is disposedinside the housing 1300, and accordingly, may be connected to theconductive pattern portion 1650 of the image sensor substrate 1600.

That is, the flexible circuit board 1800 may include a first connectorpart 1801, a second connector part 1803, and a connection part 1802.

The first connector part 1801 may be disposed inside the housing 1300.The first connector part 1801 may include a plurality of pads 1804,1805, 1806, and 1807 connected to the conductive pattern portion 1640.

The first connector part 1801 may be electrically connected to thesecond lead pattern part 1646 of the conductive pattern portion 1640.That is, the plurality of pad portions 1804, 1805, 1806, and 1807 of thefirst connector part 1801 may be electrically connected to the secondlead pattern part 1646.

To this end, the first connector part 1801 may include a first pad part1804 connected to the second lead pattern part 1646 of the firstconductive pattern part 1641. In addition, the first connector part 1801may include a second pad part 1805 connected to the second lead patternpart 1646 of the second conductive pattern part 1642. Further, the firstconnector part 1801 may include a third pad part 1806 connected to thesecond lead pattern part 1646 of the third conductive pattern part 1643.Further, the first connector part 1801 may include a fourth pad part1807 connected to the second lead pattern part 1646 of the fourthconductive pattern part 1644.

In this case, the first connector part 1801 has a shape corresponding tothe second insulating part 1612 of the insulating layer 1610, and it maybe disposed surrounding the upper region of the second lead pattern part1646 of the conductive pattern portion 1640, and the plurality of padportions 1804, 1805, 1806, and 1807 may be disposed on a lower surfacethereof.

The connection part 1802 connects the first connector part 1801 and thesecond connector part 1803. A part of the connection part 1802 may bedisposed in the housing 1300, and may be extended therefrom to beexposed to the outside of the housing 1300.

The second connector part 1803 may include a connector 1810 connected tothe main board of the terminal.

Meanwhile, the image sensor 1700 may be attached on the first insulatingpart 1631 of the insulating layer 1610. In this case, the image sensor1700 may be attached on the first insulating part 1611 so that theelectrode 710 faces upward.

In addition, a connection member 1720, such as a metal wire, is formedbetween the electrode 710 of the image sensor 1700 and the first leadpattern part 1645, so that the connection member 1720 may electricallyconnect the electrode of the image sensor and the first lead patternpart.

FIG. 24 is a diagram specifically illustrating a layer structure of aconductive pattern portion according to a second exemplary embodiment.

Referring to FIG. 24, the conductive pattern portion 1640 is disposed onthe second bonding sheet 1630 disposed on the insulating layer 1610. Inthis case, the conductive pattern portion 1640 includes a first leadpattern part 1645 disposed on the first insulating part 1611 of theinsulating layer 1610, a second lead pattern part 1646 disposed on thesecond insulating part 1612, and an extension pattern part 1647connecting therebetween.

In this case, each of the first lead pattern part 1645, the second leadpattern part 1646, and the extension pattern part 1647 may include ametal layer 1640A and a plating layer 1640B.

The metal layer 1640A may be disposed on the second bonding sheet 1630.That is, the metal layer 1640A is disposed on the second bonding sheet1630 to configure the first lead pattern part 1645, the second leadpattern part 1646, and the extension pattern part 1647, respectively

The plating layer 1640B may be disposed on the metal layer 1640A.Preferably, the plating layer 1640B may be a surface treatment layerdisposed on the metal layer 1640A.

The plating layer 1640B includes any one of Ni/Au alloy, gold (Au),electroless nickel immersion gold (ENIG), Ni/Pd alloy, and organiccompound plating (Organic Solderability Preservative, OSP).

In this case, the plating layers 1640B constituting the first leadpattern part 1645 and the second lead pattern part 1646 may correspondto each other. Alternatively, the plating layer 1640B constituting theextension pattern part 1647 may have the same thickness as the platedlayer 650B constituting the first lead pattern part 1645 and the secondlead pattern part 1646.

That is, the plating layer 1640B of each of the first lead pattern part1645, the second lead pattern part 1646 and the extension pattern part1647 may be formed on the upper and side surfaces the correspondingmetal layer 1640A.

Meanwhile, the thickness of the plating layer 1640B may be 0.3 μm to 1μm. For example, the thickness of the plating layer 1640B may be 0.3 μmto 0.7 μm. The thickness of the plating layer 1640B may be 0.3 μm to 0.5μm.

FIG. 25 is a view showing a camera device according to a thirdembodiment. Prior to the description of FIG. 25, components that aresubstantially the same as those of FIG. 17 are denoted by the samereference numerals.

Referring to FIG. 25, the camera device may include a lens barrel 1100,a lens assembly 1200, a housing 1300, an infrared cut filter part 1400,a driving part 1510, 1520, 1530, an image sensor substrate 1600, animage sensor 1700, and a flexible circuit board 1800. Here, a lensbarrel 1100, a lens assembly 1200, a housing 1300, an infrared cutfilter part 1400, a driving part 1510, 1520, 1530, an image sensor 1700,and a flexible circuit board 1800 are substantially the same as thestructure of FIG. 17, and thus a detailed description thereof will beomitted.

The image sensor substrate 1600 in FIG. 25 may include an insulatinglayer 1610, a first bonding sheet 1620, a conductive pattern portion1640, and a supporting layer 1650. That is, compared with the imagesensor substrate of FIG. 17, in the image sensor substrate of FIG. 25,the second bonding sheet has been removed on the insulating layer 1610,and accordingly, the conductive pattern portion 1640 may be disposed indirect contact with the insulating layer 1610. In this case, a bondinglayer (not shown) may be selectively disposed on the insulating layer1610 only in a region where the image sensor 1700 is disposed.

The structures of the insulating layer 1610 and the conductive patternportion 1640 in FIG. 25 are the same as those of the insulating layerand the conductive pattern portion 1640 described with reference to FIG.17. Accordingly, the upper surface of the first insulating part 1611 maydirectly contact the lower surface of the first lead pattern part 1645.In addition, the upper surface of the second insulating part 1612 maydirectly contact the lower surface of the second lead pattern part 1646.In addition, the upper surface of the extension insulating part 1614 maydirectly contact the lower surface of the extension pattern part 1647.

FIG. 26A is a view showing a camera device according to a fourthembodiment, and FIG. 26B is a plan view of a second bonding sheet inFIG. 26A. Prior to the description of FIGS. 26A and 26B, the samereference numerals are assigned to substantially the same components asthose of FIG. 17.

FIG. 26A and FIG. 26B, the camera device may include a lens barrel 1100,a lens assembly 1200, a housing 1300, an infrared cut filter part 1400,a driving part 1510, 1520, and 1530, and an image sensor substrate 1600,an image sensor 1700, and a flexible circuit board 1800. Here, a lensbarrel 1100, a lens assembly 1200, a housing 1300, an infrared cutfilter part 1400, a driving part 1510, 1520, 1530, an image sensor 1700,and a flexible circuit board 1800 are substantially the same as thestructure of FIG. 17, and thus a detailed description thereof will beomitted.

The image sensor substrate 1600 in FIGS. 26A and 26B may include aninsulating layer 1610, a first bonding sheet 1620, a second bondingsheet 1630, a conductive pattern part 1640, and a support layer 1650.That is, compared with the image sensor substrate of FIG. 17, the secondbonding sheet 1630 of the image sensor substrate of FIG. 26A may bedisposed only in a partial area on the insulating layer 1610. That is,the second bonding sheet 1630 may be selectively disposed only in aregion of the upper surface of the insulating layer 1610 in which theconductive pattern portion 1640 is to be disposed.

That is, referring to FIG. 26B, the second bonding sheet 1630 mayinclude a first bonding part 1631, a second bonding part 1632, and anextension bonding part 1634.

The first bonding part 1631 may be disposed between the first insulatingpart 1611 and the first lead pattern part 1645. The first bonding part1631 may have a shape corresponding to the first lead pattern part 1645.Preferably, the first bonding part 1631 may have a plane area equal tothat of the first lead pattern part 1645.

The second bonding part 1632 may be disposed between the secondinsulating part 1612 and the second lead pattern part 1646. The secondbonding part 1632 may have a shape corresponding to the second leadpattern part 1646. Preferably, the second bonding part 1632 may have thesame plane area as the plane area of the second lead pattern part 1646.

The extension bonding part 1634 may be disposed between the extensioninsulating part 1614 and the extension pattern part 1647. The extensionbonding part 1634 may have a shape corresponding to the extensionpattern part 1647. Preferably, the extension bonding part 1634 may havethe same plane area as that of the extension pattern part 1647.

Meanwhile, the second bonding sheet 1630 in the embodiment may be a seedlayer of the conductive pattern portion 1640. Accordingly, when theconductive pattern portion 1640 is patterned, the second bonding sheet1630 may also be removed together with the conductive pattern portion1640, and accordingly, the second bonding sheet 1630 may have the sameshape as the conductive pattern portion 1640.

According to an embodiment, in order to implement the OIS and AFfunctions of the camera module, instead of moving the conventional lensbarrel, the image sensor is moved relative to the lens barrel in theX-axis, Y-axis and Z-axis directions. Accordingly, the camera moduleaccording to the embodiment may remove a complex spring structure forimplementing the OIS and AF functions, and thus the structure may besimplified. In addition, by moving the image sensor according to theembodiment relative to the lens barrel, it is possible to provide astable structure compared to the conventional structure.

In addition, according to an embodiment, the extension pattern partelectrically connected to the image sensor has a spring structure and isdisposed in a floating form on the spring plate.

In addition, in the insulating layer, an extension insulating parthaving a spring shape is disposed in a region vertically overlappingwith the extension pattern part. Accordingly, the camera module mayelastically support the image sensor more stably and move the imagesensor with respect to the lens barrel.

In addition, the length of the extension pattern part in the embodimentis set to be at least 1.5 to 4 times the linear distance between thefirst lead pattern part and the second lead pattern part. Accordingly,noise generation can be minimized while improving the mobility of theimage sensor substrate.

In addition, in the embodiment, the width of the extension insulatingpart is made larger than the width of the extension pattern part, sothat the extension pattern part can be stably supported by the extensioninsulating part, thereby improving operational reliability.

In addition, according to the embodiment, the elastic member and theextension pattern part are not aligned with each other in a verticaldirection, thereby solving an electrical reliability problem that mayoccur due to contact between the elastic member and the extensionpattern part.

1. A substrate for image sensor comprising: an insulating layerincluding a first open region; and a conductive pattern portion disposedon the insulating layer, wherein the insulating layer comprises: a firstinsulating part; and a second insulating part spaced apart from thefirst insulating part with the first open region interposedtherebetween, wherein the conductive pattern portion comprises a firstlead pattern part disposed on the first insulating part; a second leadpattern part disposed on the second insulating part; and an extensionpattern part disposed on the first open region of the insulating layerto connect the first lead pattern part with the second lead pattern partand including a bent portion.
 2. The substrate of claim 1, comprising: aspring plate including first and second plate parts spaced apart fromeach other with a second open region therebetween, and an elastic memberdisposed in the second open region, wherein the first insulating part isdisposed on the first plate part, and wherein the second insulating partis disposed on the second plate part.
 3. The substrate of claim 1,wherein the insulating layer comprises an extension insulating partconnecting between the first insulating part and the second insulatingpart.
 4. The substrate of claim 1, wherein a length of the extensionpattern part is greater than a linear distance between the first leadpattern part and the second lead pattern part.
 5. The substrate of claim4, wherein the extension pattern part has a length of between 1.5 and 4times the linear distance between the first lead pattern part and thesecond lead pattern part.
 6. The substrate of claim 3, wherein theextension pattern part and the extension insulating part are overlappedeach other in an optical axis direction.
 7. The substrate of claim 3,wherein a line width of the extension insulation part is greater than aline width of the extension pattern part.
 8. The substrate of claim 1,wherein the first lead pattern part, the second lead pattern part, andthe extension pattern part comprise: a metal layer, and a plating layerdisposed on the metal layer.
 9. The substrate of claim 2, wherein theextension pattern part does not overlap with the elastic member in anoptical axis direction.
 10. The substrate of claim 1, wherein theextension pattern part is formed of a binary alloy of any one of copper(Cu)-nickel (Ni), copper (Cu)-tin (Sn), copper (Cu)-beryllium (Be) andcopper (Cu)-cobalt (Co), or a ternary alloy of any one of copper(Cu)-nickel (Ni)-tin (Sn) and copper (Cu)-beryllium (Be)-cobalt (Co).11. The substrate of claim 1, wherein the first open region isoverlapped with the second open region in an optical axis direction. 12.The substrate of claim 2, wherein the first plate part has at least oneslit formed in a region overlapping the first insulating part in anoptical axis direction.
 13. The substrate of claim 1, wherein theinsulating layer comprises: an elastic insulating part disposed in thefirst open region and connecting between the first and second insulatingparts, and wherein the elastic insulating part does not overlap with theextension pattern part in an optical axis direction.
 14. The substrateof claim 7, wherein the extension insulating part is overlapped with theextension pattern part in an optical axis direction, and wherein theextension pattern part is disposed on the extension insulating part. 15.The substrate of claim 14, wherein the extension pattern part has aspring shape including a plurality of bent portions, and wherein theextension insulating part has a shape corresponding to the extensionpattern part.
 16. The substrate of claim 1, wherein the extensionpattern part does not overlap with a corner region of the first openregion.
 17. The substrate of claim 2, wherein the elastic member isdisposed in a corner region of the second open region, and wherein theextension pattern part does not overlap with corner regions of the firstopen region and the second open region in the optical axis direction.18. The substrate of claim 1, wherein a line width of the extensionpattern part is smaller than a line width of each of the first andsecond lead pattern parts, and wherein the extension pattern part doesnot overlap the first insulating portion and the second insulating partin an optical axis direction.
 19. A camera module comprising: a housing;a lens barrel disposed in the housing; a lens assembly disposed in thelens barrel; an image sensor substrate disposed in the housing andincluding an insulating layer including a first open region, and aconductive pattern portion disposed on the insulating layer; wherein theinsulating layer comprises a first insulating part, and a secondinsulating part spaced apart from the first insulating part with thefirst open region interposed therebetween; wherein the conductivepattern portion comprises a first lead pattern part disposed on thefirst insulating part, a second lead pattern part disposed on the secondinsulating part, and an extension pattern part disposed on the firstopen region of the insulating layer to connect the first lead patternpart with the second lead pattern part and including a bent portion; animage sensor disposed on the first lead pattern portion of the imagesensor substrate; and a flexible circuit board including a pad connectedto the second lead pattern part of the image sensor substrate.
 20. Thecamera module of claim 19, comprising: a driving part disposed on theinsulating of the image sensor substrate to move the image sensor.